Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power Semiconductor Devices
US-2020395325-A1 · Dec 17, 2020 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2924/30101 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 173 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 11 |
| 2017 | 17 |
| 2018 | 6 |
| 2019 | 8 |
| 2020 | 10 |
| 2021 | 10 |
| 2022 | 11 |
| 2023 | 17 |
| 2024 | 22 |
| 2025 | 37 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device
US-2020365497-A1 · Nov 19, 2020 · US
Manufacturing method of semiconductor device
US-2020357771-A1 · Nov 12, 2020 · US
Defected ground structure with void having resistive material along perimeter to improve EMI suppression
US-10499489-B2 · Dec 3, 2019 · US
Interface structures and methods for forming same
US-10446487-B2 · Oct 15, 2019 · US
Semiconductor device package and a method of manufacturing the same
US-10332851-B2 · Jun 25, 2019 · US
Semiconductor device including antistatic die attach material
US-10304795-B2 · May 28, 2019 · US
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power Semiconductor Devices
US-2019067229-A1 · Feb 28, 2019 · US
Pad defined contact for wafer level package
US-10204876-B2 · Feb 12, 2019 · US
Semiconductor device
US-10199347-B2 · Feb 5, 2019 · US
Defected ground structure with void having resistive material along perimeter to improve emi suppression
US-2019021164-A1 · Jan 17, 2019 · US
Semiconductor device package and a method of manufacturing the same
US-2018374811-A1 · Dec 27, 2018 · US
Method of forming redistribution layer
US-10134694-B2 · Nov 20, 2018 · US
Method for fabricating microelectronic package with surface mounted passive element
US-2018294255-A1 · Oct 11, 2018 · US
Semiconductor device
US-10032736-B2 · Jul 24, 2018 · US
Interface structures and methods for forming same
US-2018096931-A1 · Apr 5, 2018 · US
Method of producing a semiconductor device with through-substrate via covered by a solder ball
US-9870988-B2 · Jan 16, 2018 · US
Method of producing a semiconductor device with through-substrate via covered by a solder ball
US-2017365551-A1 · Dec 21, 2017 · US
Semiconductor device including antistatic die attach material
US-2017352638-A1 · Dec 7, 2017 · US
Semiconductor device
US-9793196-B2 · Oct 17, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2924/30101?
- CPC H01L2924/30101 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2924/30101 (Electricity)?
- Our database includes 173 publications tagged with this CPC code.
- Is patent activity under CPC H01L2924/30101 growing?
- Publication counts under this code: 22 in 2024 vs 37 in 2025 (latest complete years).