Bond pad having a trench and method for forming
US-9515034-B2 · Dec 6, 2016 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2924/00015 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 214 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 33 |
| 2016 | 46 |
| 2017 | 38 |
| 2018 | 38 |
| 2019 | 24 |
| 2020 | 18 |
| 2021 | 8 |
| 2022 | 2 |
| 2023 | 1 |
| 2024 | 3 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
US-9508622-B2 · Nov 29, 2016 · US
Methods of forming conductive jumper traces
US-9508635-B2 · Nov 29, 2016 · US
Interposer for integrated circuit chip package
US-9496248-B2 · Nov 15, 2016 · US
Methods of forming articles including metal structures having maximized bond adhesion and bond reliability
US-9468986-B2 · Oct 18, 2016 · US
Semiconductor integrated circuit device
US-9466559-B2 · Oct 11, 2016 · US
Semiconductor device
US-9461002-B2 · Oct 4, 2016 · US
Wire-bonding apparatus and method of wire bonding
US-9457421-B2 · Oct 4, 2016 · US
Semiconductor device and method for manufacturing the same
US-9449937-B2 · Sep 20, 2016 · US
Enhanced flip chip structure using copper column interconnect
US-9437534-B2 · Sep 6, 2016 · US
Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP
US-9418941-B2 · Aug 16, 2016 · US
Wire-bonding apparatus and method of manufacturing semiconductor device
US-9368471-B2 · Jun 14, 2016 · US
Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages
US-9362143-B2 · Jun 7, 2016 · US
Electronic component and manufacturing method for electronic component
US-9355987-B2 · May 31, 2016 · US
Electric connection method
US-9352562-B2 · May 31, 2016 · US
Semiconductor device and manufacturing method of same
US-9343395-B2 · May 17, 2016 · US
Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
US-9329433-B2 · May 3, 2016 · US
Semiconductor device
US-9331008-B2 · May 3, 2016 · US
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof
US-9318421-B2 · Apr 19, 2016 · US
Method for fabricating wire bonding structure
US-9289846-B2 · Mar 22, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2924/00015?
- CPC H01L2924/00015 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2924/00015 (Electricity)?
- Our database includes 214 publications tagged with this CPC code.
- Is patent activity under CPC H01L2924/00015 growing?
- Publication counts under this code: 3 in 2024 vs 3 in 2025 (latest complete years).