Enhanced flip chip structure using copper column interconnect

Patent metadata

Field	Value
Publication number	US-9437534-B2
Application number	US-201514714331-A
Country	US
Kind code	B2
Filing date	May 17, 2015
Priority date	Feb 29, 2012
Publication date	Sep 6, 2016
Grant date	Sep 6, 2016

Abstract

A flip chip package includes: a carrier coupled to a die. The carrier includes: at least a via, for coupling the surface of the carrier to electrical traces in the carrier; and at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via. The die includes: at least a bond pad formed on the surface of the die; and at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein part of the copper column overhangs the via opening.

First claim

What is claimed is:

1. A flip chip package comprising:
a carrier, comprising:
at least a via, for coupling the surface of the carrier to electrical traces in the carrier, wherein the via is open and unfilled; and
at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via; and

a die, coupled to the carrier, comprising:
at least a bond pad formed on the surface of the die; and
at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein part of the copper column overhangs the via opening and part of the copper column does not overhang the via opening, so that only part of the via opening is covered by the copper column.

2. The flip chip package of claim 1 , wherein the capture pad is asymmetrical about at least one axis running through the centre of the via opening, and the part of the copper column which does not overhang the via opening is disposed on the side of the capture pad having a greater surface area.

3. The flip chip package of claim 2 , wherein the copper column is curved about the vertical plane such that it has at least one axis of asymmetry.

4. The flip chip package of claim 3 , wherein the capture pad is egg shaped and a top view of the copper column is C-shaped.

5. The flip chip package of claim 2 , wherein the capture pad comprises a rectangular section which is formed on one side about the via opening, and the part of the copper column which does not overhang the via opening copper column is disposed on the rectangular section.

6. The flip chip package of claim 1 , wherein the copper column overhangs the bond pad.

7. The flip chip package of claim 2 , wherein at least one side of the copper column is parallel to an edge of the bond pad.

Assignees

• Mediatek Inc

Inventors

• Gregorich Thomas Matthew
• Lin Tzu-Hung
• Chou Che-Ya

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/07236

  Soldering or alloying · CPC title