Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
US9508622B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9508622-B2 |
| Application number | US-201113096102-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 28, 2011 |
| Priority date | Apr 28, 2011 |
| Publication date | Nov 29, 2016 |
| Grant date | Nov 29, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor device and method for encapsulating the semiconductor device are provided. The method includes: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; applying a protective material around the plurality of wire bonds, the protective material having a first pH; and encapsulating at least a portion of the semiconductor device and the protective material with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for encapsulating a semiconductor device, the method comprising: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; covering the plurality of wire bonds with a protective material having a first pH; and depositing encapsulating material over the semiconductor device and the protective material, the encapsulating materia…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9508622B2 cover?
- A semiconductor device and method for encapsulating the semiconductor device are provided. The method includes: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; applying a protective material around the plurality of wire bonds, the protective material having a first …
- Who is the assignee on this patent?
- Higgins Iii Leo M, Freescale Semiconductor Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W74/121. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).