Electrochemical additive manufacturing system having maskless conductive seed layer
US-2025259857-A1 · Aug 14, 2025 · US
Electroplating combined with mechanical treatment during the deposition
Electroplating combined with mechanical treatment during the deposition · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/22 |
| Official title | Electroplating combined with mechanical treatment during the deposition |
| Display label | Electroplating combined with mechanical treatment during the deposition |
| Total patents | 48 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 8 |
| 2017 | 9 |
| 2018 | 2 |
| 2019 | 3 |
| 2020 | 3 |
| 2021 | 4 |
| 2022 | 5 |
| 2023 | 4 |
| 2024 | 4 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electroplating device and method for manufacturing plated product
US-12351930-B2 · Jul 8, 2025 · US
Electrochemical additive manufacturing system having conductive seed layer
US-12308251-B2 · May 20, 2025 · US
Film forming apparatus for forming metal film and film forming method for forming metal film
US-12123103-B2 · Oct 22, 2024 · US
Electrochemical additive manufacturing system having conductive seed layer
US-2024162049-A1 · May 16, 2024 · US
Coating on a surface to transmit electrical current
US-2024072473-A1 · Feb 29, 2024 · US
Electrochemical additive manufacturing method using deposition feedback control
US-11881412-B2 · Jan 23, 2024 · US
Film forming apparatus for forming metal film and film forming method for forming metal film
US-2023122871-A1 · Apr 20, 2023 · US
Electrochemical additive manufacturing method using deposition feedback control
US-2023059846-A1 · Feb 23, 2023 · US
Conductive plating apparatus, plating system and plating method for conductive film
US-2023042419-A1 · Feb 9, 2023 · US
Method for manufacturing printed wiring board and coating system for implementing the method
US-2023019554-A1 · Jan 19, 2023 · US
Electroplating device and method for manufacturing plated product
US-2022411951-A1 · Dec 29, 2022 · US
Electrochemical additive manufacturing method using deposition feedback control
US-11521864-B2 · Dec 6, 2022 · US
Method of manufacturing semiconductor device and substrate processing apparatus
US-2022084813-A1 · Mar 17, 2022 · US
Electrochemical additive manufacturing method using deposition feedback control
US-2022084840-A1 · Mar 17, 2022 · US
Electrochemical additive manufacturing of interconnection features
US-11232956-B2 · Jan 25, 2022 · US
Film forming method for metal film and film forming apparatus for metal film
US-11035049-B2 · Jun 15, 2021 · US
Method for the production of electroplated components
US-11021805-B2 · Jun 1, 2021 · US
Electrochemical additive manufacturing of interconnection features
US-2021090901-A1 · Mar 25, 2021 · US
Film deposition device of metal film and metal film deposition method
US-10920331-B2 · Feb 16, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/22?
- CPC C25D5/22 is the Cooperative Patent Classification code for “Electroplating combined with mechanical treatment during the deposition.”
- How many patents are filed under CPC C25D5/22 (Electroplating combined with mechanical treatment during the deposition)?
- Our database includes 48 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/22 growing?
- Publication counts under this code: 4 in 2024 vs 3 in 2025 (latest complete years).