Method for manufacturing printed wiring board and coating system for implementing the method

Patent metadata

Field	Value
Publication number	US-2023019554-A1
Application number	US-202217811707-A
Country	US
Kind code	A1
Filing date	Jul 11, 2022
Priority date	Jul 14, 2021
Publication date	Jan 19, 2023
Grant date	—

Abstract

A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

First claim

What is claimed is:

1 . A method for manufacturing a printed wiring board, comprising:
forming a seed layer on a surface of a resin insulating layer; applying liquid resist on the seed layer formed on the surface of the resin insulating layer; drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer; applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer; forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology; forming an electrolytic plating film on part of the seed layer exposed from the plating resist; removing the plating resist from the seed layer; and removing part of the seed layer exposed from the electrolytic plating film.

2 . The method of claim 1 , wherein the applying of pressure and heat to the resist layer is conducted after the forming of the resist layer on the seed layer.

3 . The method of claim 1 , wherein the applying of pressure and heat to the resist layer is conducted before the forming of the plating resist.

4 . The method of claim 1 , wherein the pressure is applied to the resist layer via a pressure application gas.

5 . The method of claim 4 , wherein the heat is applied to the resist layer via the pressure application gas.

6 . The method of claim 1 , wherein the forming of the resist layer includes preparing an intermediate substrate, and the applying of the pressure includes positioning the intermediate substrate in a pressure application container and introducing a pressure application gas in the pressure application container.

7 . The method of claim 6 , wherein the heat is applied to the resist layer via the pressure application gas.

8 . The method of claim 4 , wherein the pressure application gas is compressed air.

9 . The method of claim 1 , wherein the pressure is applied to the resist layer via a pressing plate.

10 . The method of claim 9 , wherein the heat is applied to the resist layer via the pressing plate.

11 . The method of claim 1 , further comprising:
roughening the surface of the resin insulating layer before the forming of the seed layer.

12 . The method of claim 11 , wherein the roughening includes roughening the surface of the resin insulating layer such that an arithmetic mean roughness Ra of a surface of the seed layer formed on the resin insulating layer becomes 0.3 μm or less.

13 . A coating system, comprising:
a liquid resist coating device configured to apply a liquid resist on a seed layer formed on a resin insulating layer; a liquid resist drying device configured to dry the liquid resist applied on the seed layer formed on the resin insulating layer and form a resist layer on the seed layer; and a pressure and heat application device configured to apply pressure and heat to an entire surface of the resist layer.

14 . The coating system according to claim 13 , wherein the liquid resist coating device comprises a roll coater including a doctor bar configured to supply the liquid resist at a predetermined thickness, and a coating roll configured to apply the liquid resist supplied from the doctor bar onto the seed layer at a predetermined thickness.

15 . The coating system according to claim 13 , wherein the pressure and heat application device includes a pressure application container configured to accommodate the resin insulating layer on which the resist layer is formed on the seed layer, a heat source positioned in the pressure application container, and a pressure source positioned in the pressure application container.

16 . The coating system according to claim 15 , wherein the heat source includes an upper hot plate positioned above the resin insulating layer on which the resist layer is formed on the seed layer, and a lower hot plate positioned below the resin insulating layer on which the resist layer is formed on the seed layer.

17 . The coating system according to claim 15 , wherein the pressure source is a pressure application gas.

18 . The coating system according to claim 16 , wherein the pressure and heat application device includes a spacer inserted between a peripheral edge part of the upper hot plate and a peripheral edge part of the lower hot plate.

19 . The coating system according to claim 17 , wherein the pressure application gas is compressed air.

20 . The coating system according to claim 13 , wherein the pressure and heat application device includes a plurality of pressing plates configured to sandwich the resin insulating layer on which the resist layer is formed on the seed layer and to apply the heat and the pressure to the resist layer.

Assignees

• Ibiden Co Ltd

Inventors

• Kadowaki Yuji
• Kano Tomomi

Classifications

• C25D7/00 Primary

  Electroplating characterised by the article coated · CPC title

• C25D5/54

  Electroplating of non-metallic surfaces (C25D7/12 takes precedence) · CPC title

• C25D5/022

  using masking means · CPC title

• H05K3/02 Primary

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title

• H05K3/0011

  Working of insulating substrates or insulating layers · CPC title