Film deposition device of metal film and metal film deposition method

Patent metadata

Field	Value
Publication number	US-10920331-B2
Application number	US-201414910416-A
Country	US
Kind code	B2
Filing date	Aug 4, 2014
Priority date	Aug 7, 2013
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A film deposition device (1A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).

First claim

The invention claimed is:

1. A film deposition device for deposition of a metal film, the film deposition device comprising
a metal ion supplier configured to supply a solution containing metal ions, the metal ion supplier including an opening having an internal space and an inner wall;
a metal positive electrode disposed in the internal space of the opening of the metal ion supplier and being engaged with the inner wall of the opening of the metal ion supplier;
a solid electrolyte membrane disposed on a surface of the positive electrode, the solid electrolyte membrane having a water content of between 15% and 80%, inclusive, by mass, and the solid electrolyte membrane being capable of containing metal ions;
a power supply part configured to apply a voltage between the metal positive electrode and a base material configured to be a negative electrode in a state where the solid electrolyte membrane is disposed on the surface of the metal positive electrode between the metal positive electrode and the base material such that metal is precipitated on a surface of the base material from the metal ions contained inside the solid electrolyte membrane;
a pressing part configured to pressurize the solid electrolyte membrane against the base material by moving the metal positive electrode toward the base material, the pressing part being connected to a cap part of the metal ion supplier;
a solution tank configured to house the solution containing the metal ions, the solution tank being connected via a supply tube to one side of the metal ion supplier;
a waste liquid tank configured to recover waste liquid, the waste liquid tank being connected via a waste liquid tube to another side of the metal ion supplier;
a pedestal configured to fix the base material and adjust alignment of the base material; and
a temperature controller configured to adjust the temperature of the base material via the pedestal;
wherein the metal positive electrode is a foamed metal body made of foam having continuous open cells,
wherein the solution containing the metal ions is capable of transmitting through the metal positive electrode such that the metal ions are supplied to the solid electrolyte membrane.

2. The film deposition device for deposition of a metal film according to claim 1 , wherein the metal positive electrode has a porosity of between 50 to 95% by volume, a pore diameter of 50 to 600 μm, and a thickness of between 0.1 and 50 mm.

3. A film deposition device for deposition of a metal film, the film deposition device comprising
a metal ion supplier configured to supply a solution containing metal ions, the metal ion supplier including an opening having an internal space and an inner wall;
a metal positive electrode disposed in the internal space of the opening of the metal ion supplier and being engaged with the inner wall of the opening of the metal ion supplier; and
a solid electrolyte membrane disposed on a surface of the positive electrode, the solid electrolyte membrane having a water content of between 15% and 80%, inclusive, by mass, and the solid electrolyte membrane being capable of containing metal ions;
wherein the metal positive electrode is a foamed metal body made of foam having continuous open cells.

4. The film deposition device for deposition of a metal film according to claim 3 , the film deposition device further comprising:
a power supply part configured to apply a voltage between the metal positive electrode and a base material configured to be a negative electrode in a state where the solid electrolyte membrane is disposed on the surface of the metal positive electrode between the metal positive electrode and the base material such that metal is precipitated on a surface of the base material from the metal ions contained inside the solid electrolyte membrane; and,
a pressing part configured to pressurize the solid electrolyte membrane against the base material by moving the metal positive electrode toward the base material, the pressing part being connected to a cap part of the metal ion supplier.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki
• Yanagimoto Hiroshi
• Hiraoka Motoki

Classifications

• C25D5/611

  Smooth layers · CPC title

• C25D5/22 Primary

  Electroplating combined with mechanical treatment during the deposition · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D3/38

  of copper · CPC title