Conductive plating apparatus, plating system and plating method for conductive film

Patent metadata

Field	Value
Publication number	US-2023042419-A1
Application number	US-202217891164-A
Country	US
Kind code	A1
Filing date	Aug 19, 2022
Priority date	Feb 20, 2020
Publication date	Feb 9, 2023
Grant date	—

Abstract

Provided are a conductive plating apparatus, a plating system and a plating method for a conductive film. The conductive plating apparatus is configured to electrically connect the conductive film with a power supply. A first conductive structure includes a first conductive roller and a first press roller. A second conductive structure includes a second conductive roller and a second press roller. The first and second conductive structures are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second the conductive roller and the second press roller. The first and second press rollers are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film, respectively, and to be equipotential. The second press roller and the first conductive roller are configured to be equipotential.

First claim

What is claimed is:

1 . A plating system, configured to form a first plating layer and a second plating layer on a conductive film, the plating system comprising:
a conductive plating apparatus configured to electrically connect a conductive film with a power supply, the conductive plating apparatus comprising:
a first conductive structure comprising a first conductive roller and a first press roller; and
a second conductive structure comprising a second conductive roller and a second press roller; and
a plating tank configured to contain plating solution, wherein the first conductive structure and the second conductive structure are configured to allow the conductive film to sequentially pass between the first conductive roller and the first press roller and between the second conductive roller and the second press roller; wherein the first press roller and the second press roller are configured to be brought into contact with and apply pressures to two opposite surfaces of the conductive film respectively; wherein the first press roller and the second conductive roller are configured to be equipotential; wherein the second press roller and the first conductive roller are configured to be equipotential; wherein the conductive plating apparatus is arranged outside the plating tank; and wherein the plating tank comprises a first plating tank and a second plating tank, the first plating tank being located at a side of the first conductive structure away from the second conductive structure, and the second plating tank being located at a side of the second conductive structure away from the first conductive structure, optionally, the first plating tank is in communication with the second plating tank.

2 . The plating system according to claim 1 , further comprising:
a first separation structure for separating the first plating tank from the conductive liquid tank; and a second separation structure for separating the second plating tank from the conductive liquid tank.

3 . The plating system according to claim 2 , wherein:
the first separation structure comprises a first liquid separation tank and a second liquid separation tank that are both located between the first plating tank and the conductive liquid tank, the first liquid separation tank being close to the first plating tank; and the second separation structure comprises a third liquid separation tank and a fourth liquid separation tank that are both located between the second plating tank and the conductive liquid tank, the fourth liquid separation tank being close to the second plating tank.

4 . The plating system according to claim 3 ,further comprising:
a first liquid recycling tank located between the first liquid separation tank and the second liquid separation tank; and a second liquid recycling tank located between the third liquid separation tank and the fourth liquid separation tank.

5 . The plating system according to claim 4 , wherein:
a set of first liquid stopping rollers is arranged at an interface between the first plating tank and the first liquid separation tank; a set of second liquid stopping rollers is arranged at an interface between the second plating tank and the fourth liquid separation tank; a set of third liquid stopping rollers is arranged at an interface between the conductive liquid tank and the second liquid separation tank; a set of fourth liquid stopping rollers is arranged at an interface between the conductive liquid tank and the third liquid separation tank; a set of first liquid pressing rollers is arranged in the first liquid recycling tank; and a set of second liquid pressing rollers is arranged in the second liquid recycling tank.

6 . The plating system according to claim 1 , wherein the first conductive roller and the second press roller are electrically connected to each other; and the second conductive roller and the first press roller are electrically connected to each other,
optionally, the first conductive roller and the second press roller are electrically connected to each other by a wire, and the second conductive roller and the first press roller are electrically connected to each other by a wire.

7 . The plating system according to claim 1 , wherein:
the first press roller is configured to be brought into contact with a first surface of the conductive film and apply a pressure to the first conductive roller, in such a manner that the first press roller and the first conductive roller are pressed against the conductive film; and the second press roller is configured to be brought into contact with a second surface of the conductive film and apply a pressure to the second conductive roller, in such a manner that the second press roller and the second conductive roller are pressed against the conductive film.

8 . The plating system according to claim 7 , wherein the first conductive roller and the second conductive roller are configured in such a manner that the conductive film has an angle of contact when the conductive film is delivered.

9 . The plating system according to claim 8 , wherein:
the first press roller is located at a middle of the angle of contact on the first conductive roller; and the second press roller is located at a middle of the angle of contact on the second conductive roller.

10 . The plating system according to claim 1 , wherein each of the first press roller and the second press roller is a rubber roller.

11 . The plating system according to claim 1 , further comprising a spray device configured to spray conductive liquid to the conductive film that is being delivered or/and the conductive roller that is rotating, in such a manner that the conductive film and the respective conductive roller are capable of being electrically conductive by the sprayed conductive liquid.

12 . The plating system according to claim 11 , wherein the spray device comprise a first spray device and a second spray device, the first spray device being configured to spray the conductive liquid into a gap formed between the conductive film and the first conductive roller, and the second spray device being configured to spray the conductive liquid into a gap formed between the conductive film and the second conductive roller.

13 . The plating system according to claim 12 , wherein:
the first conductive structure and the second conductive structure are arranged sequentially in a delivering direction of the conductive film; the first spray device is located upstream of the first conductive roller; and the second spray device is located downstream of the first conductive roller and upstream of the second conductive roller.

14 . The plating system according to claim 10 , further comprising a conductive liquid tank configured to contain the conductive liquid, wherein the first conductive structure, the second conductive structure, and the spray device are all located in the conductive liquid tank;
optionally, both an axis of the first conductive roller and an axis of the second conductive roller are arranged substantially horizontally, the axis of the first conductive roller being lower than the axis of the second conductive roller, and the first conductive roller is at least partially immersed in the conductive liquid; or optionally, the axis of the first conductive roller is higher than the axis of the second conductive roller, and the second conductive roller is at least partially immersed in the conductive liquid.

Assignees

• Xiamen Hithium Energy Storage Tech Co Ltd

Inventors

• Zhang Wancai
• Feng Junmin
• Wu Tingting

Classifications

• C25D17/005

  Contacting devices · CPC title

• C25D7/0685 Primary

  Spraying of electrolyte · CPC title

• C25D7/0621 Primary

  In horizontal cells · CPC title

• C25D21/02

  Heating or cooling · CPC title

• C25D7/0657

  Conducting rolls · CPC title