Electrochemical additive manufacturing system having maskless conductive seed layer

Patent metadata

Field	Value
Publication number	US-2025259857-A1
Application number	US-202519195432-A
Country	US
Kind code	A1
Filing date	Apr 30, 2025
Priority date	Aug 23, 2019
Publication date	Aug 14, 2025
Grant date	—

Abstract

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

First claim

What is claimed is:

1 . An electrochemical additive manufacturing system, comprising:
a reaction chamber configured to retain an ionic solution that can be decomposed by electrolysis; an anode array disposed in the reaction chamber and configured to be immersed in the ionic solution; a substrate disposed in the reaction chamber, wherein the substrate comprises a plate and a conductive seed layer on the plate, wherein the conductive seed layer defines a deposition surface of the substrate and the deposition surface is configured to be in contact with the ionic solution; a mechanical positioning system configured to modify one or more of a position and orientation of one or more of the anode array and the substrate so that a gap is defined between the deposition surface and the anode array; a microcontroller programmed to:
transmit control signals to the mechanical positioning system to modify the relative position and orientation of the anode array and the substrate so that:
the anode array and the deposition surface are substantially coplanar; and
the anode array is aligned with a predetermined position of one or more features of the substrate;

accept a three-dimensional model of features to be added to the substrate; and
based on the three-dimensional model of features and measurement of at least one of current or voltage of at least one anode of the anode array, control the current through the at least one anode of the anode array to construct at least one of the one or more features of the substrate on the deposition surface at the predetermined position; and
a fluid system configured to constrain flow of the ionic solution through the gap such that the ionic solution flows across the anode array and the substrate from a first side of the anode array and the substrate, in a direction parallel to the anode array and the deposition surface, to a second side of the anode array and the substrate, which is opposite the first side.

2 . The electrochemical additive manufacturing system of claim 1 , wherein the microcontroller is programmed to control the current through the at least one anode of the anode array based on the three-dimensional model of features and measurement of the current of the at least one anode of the anode array.

3 . The electrochemical additive manufacturing system of claim 1 , wherein the microcontroller is programmed to control the current through the at least one anode of the anode array based on the three-dimensional model of features and measurement of the voltage of the at least one anode of the anode array.

4 . The electrochemical additive manufacturing system of claim 1 , wherein:
the ionic solution enters the gap from the first side of the anode array and the substrate and exits the gap from the second side of the anode array and the substrate; and the fluid system is configured to recirculate the ionic solution, exiting from the second side of the anode array and the substrate, back to the first side of the anode array and the substrate for re-entry into the gap.

5 . The electrochemical additive manufacturing system of claim 1 , wherein the fluid system further comprises a temperature control system operable to control a temperature of the ionic solution flowing through the gap.

6 . The electrochemical additive manufacturing system of claim 5 , wherein the temperature control system comprises a temperature gauge and at least one of a heater or a chiller.

7 . The electrochemical additive manufacturing system of claim 1 , wherein the fluid system further comprises at least one ion concentration sensor configured to sense a concentration of ions in the ionic solution.

8 . The electrochemical additive manufacturing system of claim 1 , wherein the fluid system further comprises a leaching system operable to absorb undesired byproducts in the ionic solution.

9 . The electrochemical additive manufacturing system of claim 1 , wherein the fluid system further comprises a replenishment system configured to add electrolyte bath components into the ionic solution as electrolyte batch components are consumed during the construction of the at least one of the one or more features of the substrate.

10 . The electrochemical additive manufacturing system of claim 1 , wherein the microcontroller is further programmed to initiate a bubble clearing cycle of the ionic solution.

11 . The electrochemical additive manufacturing system of claim 10 , wherein the microcontroller is programmed to initiate the bubble clearing cycle periodically according to a predefined schedule.

12 . The electrochemical additive manufacturing system of claim 10 , wherein the microcontroller is programmed to initiate the bubble clearing cycle based on measurements of conditions of the electrochemical additive manufacturing system.

13 . The electrochemical additive manufacturing system of claim 12 , wherein the measurements comprise a measurement of at least one of current or voltage at one or more anodes of the anode array.

14 . The electrochemical additive manufacturing system of claim 10 , wherein:
the fluid system further comprises a transducer in contact with at least one of the anode array, the substrate, or the ionic solution; and the bubble clearing cycle comprises pulsing flow of the ionic solution through the gap via the transducer.

15 . The electrochemical additive manufacturing system of claim 14 , wherein the flow of the ionic solution is pulsed at an ultrasonic frequency.

16 . The electrochemical additive manufacturing system of claim 10 , further comprising a vibrator, wherein the bubble clearing cycle comprises vibrating the anode array and the substrate via the vibrator.

Assignees

• Fabric8Labs Inc

Inventors

• Pain David
• Edmonds Andrew
• Herman Jeffrey
• Pateros Charles
• Shaik Kareemullah

Classifications

• H10W70/041

  Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/237

  Multiple bump connectors having different shapes · CPC title

• H10W72/247

  Dispositions of multiple bumps · CPC title