Electroplating apparatus with membrane tube shield
US-10081881-B2 · Sep 25, 2018 · US
Electroplating with moving electrodes
Electroplating with moving electrodes · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D5/04 |
| Official title | Electroplating with moving electrodes |
| Display label | Electroplating with moving electrodes |
| Total patents | 202 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 30 |
| 2017 | 15 |
| 2018 | 14 |
| 2019 | 28 |
| 2020 | 18 |
| 2021 | 19 |
| 2022 | 18 |
| 2023 | 18 |
| 2024 | 16 |
| 2025 | 20 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Copper foil having improved adhesive force, electrode including the same, secondary battery including the same, and method of manufacturing the same
US-2018261850-A1 · Sep 13, 2018 · US
Electroplating apparatus for tailored uniformity profile
US-10017869-B2 · Jul 10, 2018 · US
Copper film with large grains, copper clad laminate having the same and manufacturing method of copper clad laminate
US-9994967-B2 · Jun 12, 2018 · US
Apparatus and method for modulating azimuthal uniformity in electroplating
US-9988733-B2 · Jun 5, 2018 · US
Process for optimizing cobalt electrofill using sacrificial oxidants
US-2018119305-A1 · May 3, 2018 · US
Easily handleable electrolytic copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same
US-2018102546-A1 · Apr 12, 2018 · US
Electroplating apparatus, electroplating method, and manufacturing method of semiconductor device
US-2018073160-A1 · Mar 15, 2018 · US
Film formation system and film formation method for forming metal film
US-9909226-B2 · Mar 6, 2018 · US
Dynamic modulation of cross flow manifold during elecroplating
US-2017342583-A1 · Nov 30, 2017 · US
Control of electrolyte flow dynamics for uniform electroplating
US-9816194-B2 · Nov 14, 2017 · US
Localized, in-vacuum modification of small structures
US-9812286-B2 · Nov 7, 2017 · US
Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition
US-9777385-B2 · Oct 3, 2017 · US
Apparatus and method for uniform metallization on substrate
US-2017260641-A1 · Sep 14, 2017 · US
Film forming apparatus and film forming method
US-9752249-B2 · Sep 5, 2017 · US
Systems and methods for shielding features of a workpiece during electrochemical deposition
US-2017191180-A1 · Jul 6, 2017 · US
Electrofill vacuum plating cell
US-9677188-B2 · Jun 13, 2017 · US
Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping
US-2017145577-A1 · May 25, 2017 · US
Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition
US-2017145584-A1 · May 25, 2017 · US
Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition
US-2017145578-A1 · May 25, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D5/04?
- CPC C25D5/04 is the Cooperative Patent Classification code for “Electroplating with moving electrodes.”
- How many patents are filed under CPC C25D5/04 (Electroplating with moving electrodes)?
- Our database includes 202 publications tagged with this CPC code.
- Is patent activity under CPC C25D5/04 growing?
- Publication counts under this code: 16 in 2024 vs 20 in 2025 (latest complete years).