Film forming apparatus and film forming method

Patent metadata

Field	Value
Publication number	US-9752249-B2
Application number	US-201615062293-A
Country	US
Kind code	B2
Filing date	Mar 7, 2016
Priority date	Mar 11, 2015
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A film forming apparatus includes: an anode; a solid electrolyte membrane that is arranged between the anode and an substrate that serves as a cathode, and that contains metal ions; a power supply that applies a voltage between the anode and the substrate in a state in which the solid electrolyte membrane is in contact with the substrate from above; and an oscillating portion configured to oscillate at least the anode in the state in which the solid electrolyte membrane is in contact with the substrate.

First claim

What is claimed is:

1. A film forming apparatus comprising:
an anode;
a solid electrolyte membrane that is arranged between the anode and a substrate that serves as a cathode, and that contains metal ions;
a power supply that applies a voltage between the anode and the substrate in a state in which the solid electrolyte membrane is in contact with the substrate from above;
an oscillating portion configured to oscillate at least the anode in the state in which the solid electrolyte membrane is in contact with the substrate; and
a liquid storing portion provided between the anode and the solid electrolyte membrane, the liquid storing portion storing an electrolytic solution that contains the metal ions in a manner such that the electrolytic solution contacts the anode and the solid electrolyte membrane, wherein
the liquid storing portion includes a liquid supply port that supplies the electrolytic solution into the liquid storing portion, and a liquid discharge port that discharges the electrolytic solution from within the liquid storing portion, the liquid supply port and the liquid discharge port being provided such that the electrolytic solution flows between the anode and the solid electrolyte membrane, wherein
the liquid discharge port is provided in a position higher than the liquid supply port, wherein
a surface of the anode that faces the solid electrolyte membrane is inclined upward with respect to a horizontal plane, in a direction from the liquid supply port toward the liquid discharge port.

2. The film forming apparatus according to claim 1 , further comprising:
a gas discharge port that discharges gas that is inside the liquid storing portion, the gas discharge port being provided in a position higher than the liquid discharge port, between the liquid supply port and the liquid discharge port, the gas discharge port being provided closer to the liquid discharge port than the liquid supply port.

3. The film forming apparatus according to claim 1 , wherein
the anode includes
a first surface that faces the solid electrolyte membrane;
a second surface that is on a side opposite the first surface; and
a through-hole provided from the first surface through to the second surface.

4. The film forming apparatus according to claim 3 , wherein the liquid discharge port is provided on a second surface side with respect to the anode.

Assignees

• Toyota Motor Co Ltd

Inventors

• Hiraoka Motoki
• Yanagimoto Hiroshi
• Sato Yuki

Classifications

• C25D5/04

  Electroplating with moving electrodes · CPC title

• C25D17/002 Primary

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D21/04

  Removal of gases or vapours {; Gas or pressure control} · CPC title

• C25D3/00

  Electroplating: Baths therefor · CPC title