Apparatus and method for uniform metallization on substrate

Patent metadata

Field	Value
Publication number	US-2017260641-A1
Application number	US-201415529285-A
Country	US
Kind code	A1
Filing date	Nov 25, 2014
Priority date	Nov 25, 2014
Publication date	Sep 14, 2017
Grant date	—

Abstract

An apparatus and method for uniform metallization on substrate are provided, achieving highly uniform metallic film deposition at a rate far greater than a conventional film growth rate in electrolyte solutions. The apparatus includes an immersion bath ( 3021 ), at least one set of electrode ( 3002 ), a substrate holder ( 3003 ), at least one ultra/mega sonic device ( 3004 ), a reflection plate ( 3005 ), and a rotating actuator ( 3030 ). The immersion bath contains at least one metal salt electrolyte ( 3020 ). The at least one set of electrode ( 3002 ) connects to an independent power supply. The substrate holder ( 3003 ) holds at least one substrate and electrically connects with a conductive side of the substrate. The conductive side of the substrate is exposed to face the electrode. The at least one ultra/mega sonic device ( 3004 ) and the reflection plate ( 3005 ) are disposed parallel for generating ultra/mega sonic standing wave in the immersion bath. The rotating actuator ( 3030 ) rotates the substrate holder ( 3003 ) along its axis in the standing wave field, so as to result in a uniform overall power intensity distribution across the substrate in an accumulated time.

First claim

1 . An apparatus for uniform metallization on substrate comprising:
an immersion bath containing at least one metal salt electrolyte; at least one set of electrode connecting to an independent power supply; a substrate holder holding at least one substrate and electrically connecting with a conductive side of the substrate, the conductive side of the substrate exposed to face the electrode; at least one ultra/mega sonic device and a reflection plate disposed parallel for generating ultra/mega sonic standing wave in the immersion bath; and a rotating actuator rotating the substrate holder along its axis in the standing wave field, so as to result in a uniform overall power intensity distribution across the substrate in an accumulated time.

2 . The apparatus of claim 1 , further comprising a horizontal actuator oscillating the substrate holder along propagation direction of the ultra/mega sonic standing wave.

3 . The apparatus of claim 2 , wherein the amplitude of the substrate oscillation equals to

N
·

λ
4

,

N
=
1

,
2
,

3



…

where λ is the wavelength of the ultra/mega sonic standing wave and N is an integer.

4 . The apparatus of claim 1 , further comprising a horizontal actuator oscillating the substrate holder along a direction tilted an angle θ relative to normal direction of propagation direction of the ultra/mega sonic standing wave.

5 . The apparatus of claim 4 , wherein the amplitude of the substrate oscillation equals to

N
·

λ
4

sin



θ

,

N
=
1

,
2
,

3



…

where λ is the wavelength of the ultra/mega sonic standing wave and N is an integer, θ is the angle between the substrate oscillation direction and the normal direction of propagation direction of the ultra/mega sonic standing wave.

6 . The apparatus of claim 4 , wherein the θ is 0-45 degrees.

7 . The apparatus of claim 1 , further comprising a vertical actuator moving the substrate holder up and down to load or unload the substrate into or out of the immersion bath.

8 . The apparatus of claim 1 , further comprising a vertical actuator oscillating the substrate holder along a direction that an angle θ is formed between the substrate holder oscillation direction and normal direction of propagation direction of the ultra/mega sonic standing wave.

9 . The apparatus of claim 8 , wherein the amplitude of the substrate oscillation equals to

N
·

λ
4

sin



θ

,

N
=
1

,
2
,

3



…

where λ is the wavelength of the ultra/mega sonic standing wave and N is an integer, θ is the angle between the substrate oscillation direction and the normal direction of propagation direction of the ultra/mega sonic standing wave.

10 . The apparatus of claim 8 , wherein the vertical actuator moves the substrate holder up and down to load or unload the substrate into or out of the immersion bath.

11 . The apparatus of claim 8 , wherein the vertical actuator oscillates the substrate holder along the direction perpendicular to the horizontal plane.

12 . The apparatus of claim 8 , wherein the vertical actuator oscillates the substrate holder along the direction tilted an angle relative to the normal direction of the horizontal plane.

13 . The apparatus of claim 12 , wherein the substrate and the electrode are set with a tilted angle relative to the horizontal plane.

14 . The apparatus of claim 1 , wherein each set of electrode includes one piece of electrode or more pieces of electrodes with independent power control.

15 . The apparatus of claim 1 , further comprising at least one layer of permeable membrane being set between the substrate and the electrode.

16 . The apparatus of claim 1 , wherein the rotation speed of the rotating actuator is in the range of 10 to 100 rpm.

17 . The apparatus of claim 1 , wherein the ultra/mega sonic device and the reflection plate are mounted on opposite sidewalls of the immersion bath and tilt an angle θ relative to the substrate oscillation direction, and the substrate is set parallel to the horizontal plane, the substrate oscillation direction is perpendicular to the horizontal plane.

18 . The apparatus of claim 1 , wherein the ultra/mega sonic device and the reflection plate are mounted on opposite sidewalls of the immersion bath and perpendicular to the horizontal plane, the substrate and the electrode are set with a tilted angle relative to the horizontal plane, the substrate is oscillated along a direction tilted the angle relative to the normal direction of the horizontal plane.

19 . The apparatus of claim 1 , further comprising an adjusting mechanism for adjusting the surface of the reflection plate to be parallel to the surface of the ultra/mega sonic device.

20 . The apparatus of claim 19 , wherein the adjusting mechanism includes an oscillating actuator for oscillating the reflection plate along propagation direction of the ultra/mega sonic standing wave, the oscillation amplitude is equal to N times of half wavelength of the ultra/mega sonic standing wave, N is an integer number from 1 to 10.

21 . The apparatus of claim 20 , wherein the frequency of the oscillating actuator is 1 to 10 HZ.

22 . An apparatus for uniform metallization on substrate comprising:
an immersion bath containing at least one metal salt electrolyte; at least one set of electrode connecting to an independent power supply; a substrate holder holding at least one substrate and electrically connecting with a conductive side of the substrate,

Assignees

• Acm Research Shanghai Inc

Inventors

• Wang Xi
• Wang Hui

Classifications

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D5/20 Primary

  Electroplating using ultrasonic waves · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D5/04

  Electroplating with moving electrodes · CPC title