Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition

US2017145584A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017145584-A1
Application numberUS-201715415246-A
CountryUS
Kind codeA1
Filing dateJan 25, 2017
Priority dateNov 19, 2015
Publication dateMay 25, 2017
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

First claim

Opening claim text (preview).

We claim: 1 . An apparatus comprising: a reaction chamber configured to retain an ionic solution that can be decomposed by electrolysis; a plurality of anodes disposed in the reaction chamber and configured to be immersed in the ionic solution; a cathode disposed in the reaction chamber; a system for electro-mechanically positioning either the plurality of anodes, the cathode, or both; and a microcontroller programmed to process a three dimensional model of an object into electrical signals which: (i) control the current applied to each anode of the plurality of anodes; (ii) control the electro-mechanical positioning of the plurality of anodes, or the cathode, or both. 2 . The apparatus of claim 1 , wherein the plurality of anodes comprises an anode array having a geometrical shape that is chosen from the group consisting of hexagonal, rectangular, square, or circular geometrical shapes. 3 . The apparatus of claim 1 , wherein each of the plurality of anodes has an exposed surface having a geometric shape chosen from the group consisting of a hexagon, a rectangle, a triangle, a square, or a circle. 4 . The apparatus of claim 2 , wherein the anode array is constructed upon a printed circuit board, doped or undoped semiconductor, or other means of separating conductive elements from one another and aligning them in a pre-determined pattern. 5 . The apparatus of claim 2 , wherein the anode array is connected electrically to, or disposed upon an integrated circuit, semiconductor, or combination of conductive and insulative elements meant for biasing the plurality of anodes. 6 . The apparatus of claim 1 , wherein the plurality of anodes is arranged in rows. 7 . The apparatus of claim 1 , wherein each of the plurality of anodes is insulated from one another and is biased individually. 8 . The apparatus of claim 1 , wherein each of the plurality of anodes is insulated from one another and is biased in groups of anodes. 9 . The apparatus of claim 1 , wherein each of the plurality of anodes is constructed out of a material resistant to physical depletion through electrolysis. 10 . The apparatus of claim 1 , wherein the electro-mechanical positioning system includes an actuator and a control system in communication with the microcontroller. 11 . In a reaction chamber for retaining an ionic solution, the reaction chamber having a plurality of anodes and a cathode, a method comprising: a) At a microcontroller associated with the plurality of anodes and the cathode, receiving layer slice information about a structure to be fabricated layer by layer; b) Under the control of the microcontroller, providing to the reaction chamber the ionic solution containing metal ions to be deposited on the cathode according to the received layer slice information for the layer to be fabricated; c) Under the control of the microcontroller, processing the layer slice information for the layer to be fabricated and adjusting the relative position of the plurality of anodes and the cathode; d) Under the control of the microcontroller, processing the layer slice information for the layer to be fabricated, depositing the layer to be fabricated on the cathode by providing individualized current to each of the plurality of anodes thereby causing an electrochemical reaction at the cathode; and, e) Repeating steps (a) through (e) for each layer of the structure to be fabricated until all layers are deposited. 12 . The method of claim 11 , wherein adjusting the relative position of the plurality of anodes and the cathode includes moving the plurality of anodes relative to the cathode by using an electro-mechanical positioning system under control of the microcontroller. 13 . The method of claim 11 , wherein adjusting the relative position of the plurality of anodes and the cathode includes moving the cathode relative to the plurality of anodes by using an electro-mechanical positioning system under control of microcontroller. 14 . The method of claim 11 , wherein adjusting the relative position of the plurality of anodes and the cathode includes moving the cathode and the plurality of anodes by using an electro-mechanical positioning system under control of the microcontroller. 15 . The method of claim 11 , wherein depositing the layer to be fabricated on the cathode includes depositing at least one material selected from group consisting of gold, silver, zinc, Zn/Fe/Co/Ni alloys, copper, nickel, tin, iron, stainless steel, aluminum, titanium, polypyrrole, silicon, tungsten carbide MMC, PMC, BNNT Reinforced 316L, and SWCNT/Cu matrix. 16 . The method of claim 11 , wherein the temperature of the ionic solution is maintained between 0° C. and 300° C. 17 . The method of claim 11 , wherein the current applied to the plurality of anodes is maintained between 0.1A/dm 2 and 1200 A/dm 2 . 18 . The method of claim 9 , wherein the voltage applied between any single anode and the cathode is maintained between 0.2 V and 7.2 V. 19 . The method of claim 11 , wherein repeating steps (a) through (e) includes repeated deposits of the same material. 20 . The method of claim 11 , wherein repeating steps (a) through (e) includes depositing a different material than the first deposition at least once.

Assignees

Inventors

Classifications

  • Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

  • C25D1/003Primary

    3D structures, e.g. superposed patterned layers · CPC title

  • Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires · CPC title

  • from cyanide baths · CPC title

  • Aluminium · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2017145584A1 cover?
An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.
Who is the assignee on this patent?
Fabric8Labs Inc, Fabric8Labs Inc
What technology area does this patent fall under?
Primary CPC classification C25D1/003. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu May 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).