Electrochemical process for the preparation of lead foam
US-2016281250-A1 · Sep 29, 2016 · US
US2017145584A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017145584-A1 |
| Application number | US-201715415246-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 25, 2017 |
| Priority date | Nov 19, 2015 |
| Publication date | May 25, 2017 |
| Grant date | — |
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An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.
Opening claim text (preview).
We claim: 1 . An apparatus comprising: a reaction chamber configured to retain an ionic solution that can be decomposed by electrolysis; a plurality of anodes disposed in the reaction chamber and configured to be immersed in the ionic solution; a cathode disposed in the reaction chamber; a system for electro-mechanically positioning either the plurality of anodes, the cathode, or both; and a microcontroller programmed to process a three dimensional model of an object into electrical signals which: (i) control the current applied to each anode of the plurality of anodes; (ii) control the electro-mechanical positioning of the plurality of anodes, or the cathode, or both. 2 . The apparatus of claim 1 , wherein the plurality of anodes comprises an anode array having a geometrical shape that is chosen from the group consisting of hexagonal, rectangular, square, or circular geometrical shapes. 3 . The apparatus of claim 1 , wherein each of the plurality of anodes has an exposed surface having a geometric shape chosen from the group consisting of a hexagon, a rectangle, a triangle, a square, or a circle. 4 . The apparatus of claim 2 , wherein the anode array is constructed upon a printed circuit board, doped or undoped semiconductor, or other means of separating conductive elements from one another and aligning them in a pre-determined pattern. 5 . The apparatus of claim 2 , wherein the anode array is connected electrically to, or disposed upon an integrated circuit, semiconductor, or combination of conductive and insulative elements meant for biasing the plurality of anodes. 6 . The apparatus of claim 1 , wherein the plurality of anodes is arranged in rows. 7 . The apparatus of claim 1 , wherein each of the plurality of anodes is insulated from one another and is biased individually. 8 . The apparatus of claim 1 , wherein each of the plurality of anodes is insulated from one another and is biased in groups of anodes. 9 . The apparatus of claim 1 , wherein each of the plurality of anodes is constructed out of a material resistant to physical depletion through electrolysis. 10 . The apparatus of claim 1 , wherein the electro-mechanical positioning system includes an actuator and a control system in communication with the microcontroller. 11 . In a reaction chamber for retaining an ionic solution, the reaction chamber having a plurality of anodes and a cathode, a method comprising: a) At a microcontroller associated with the plurality of anodes and the cathode, receiving layer slice information about a structure to be fabricated layer by layer; b) Under the control of the microcontroller, providing to the reaction chamber the ionic solution containing metal ions to be deposited on the cathode according to the received layer slice information for the layer to be fabricated; c) Under the control of the microcontroller, processing the layer slice information for the layer to be fabricated and adjusting the relative position of the plurality of anodes and the cathode; d) Under the control of the microcontroller, processing the layer slice information for the layer to be fabricated, depositing the layer to be fabricated on the cathode by providing individualized current to each of the plurality of anodes thereby causing an electrochemical reaction at the cathode; and, e) Repeating steps (a) through (e) for each layer of the structure to be fabricated until all layers are deposited. 12 . The method of claim 11 , wherein adjusting the relative position of the plurality of anodes and the cathode includes moving the plurality of anodes relative to the cathode by using an electro-mechanical positioning system under control of the microcontroller. 13 . The method of claim 11 , wherein adjusting the relative position of the plurality of anodes and the cathode includes moving the cathode relative to the plurality of anodes by using an electro-mechanical positioning system under control of microcontroller. 14 . The method of claim 11 , wherein adjusting the relative position of the plurality of anodes and the cathode includes moving the cathode and the plurality of anodes by using an electro-mechanical positioning system under control of the microcontroller. 15 . The method of claim 11 , wherein depositing the layer to be fabricated on the cathode includes depositing at least one material selected from group consisting of gold, silver, zinc, Zn/Fe/Co/Ni alloys, copper, nickel, tin, iron, stainless steel, aluminum, titanium, polypyrrole, silicon, tungsten carbide MMC, PMC, BNNT Reinforced 316L, and SWCNT/Cu matrix. 16 . The method of claim 11 , wherein the temperature of the ionic solution is maintained between 0° C. and 300° C. 17 . The method of claim 11 , wherein the current applied to the plurality of anodes is maintained between 0.1A/dm 2 and 1200 A/dm 2 . 18 . The method of claim 9 , wherein the voltage applied between any single anode and the cathode is maintained between 0.2 V and 7.2 V. 19 . The method of claim 11 , wherein repeating steps (a) through (e) includes repeated deposits of the same material. 20 . The method of claim 11 , wherein repeating steps (a) through (e) includes depositing a different material than the first deposition at least once.
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