Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device
US-2017245372-A1 · Aug 24, 2017 · US
containing more than 50% by weight of copper
containing more than 50% by weight of copper · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D3/58 |
| Official title | containing more than 50% by weight of copper |
| Display label | containing more than 50% by weight of copper |
| Total patents | 220 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 24 |
| 2016 | 33 |
| 2017 | 33 |
| 2018 | 24 |
| 2019 | 22 |
| 2020 | 29 |
| 2021 | 14 |
| 2022 | 13 |
| 2023 | 7 |
| 2024 | 14 |
| 2025 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plating solution for threaded connection for pipe or tube and producing method of threaded connection for pipe or tube
US-2017051421-A1 · Feb 23, 2017 · US
Sulfonamide based polymers for copper electroplating
US-9562300-B2 · Feb 7, 2017 · US
Electrolytic copper plating solution analyzer, and electrolytic copper plating solution analysis method
US-2016377573-A1 · Dec 29, 2016 · US
Oxidation-resistant elongate electrically conductive element
US-9514858-B2 · Dec 6, 2016 · US
Carrier-Attached Copper Foil, Laminate, Printed-Wiring Board And Method For Manufacturing The Printed Wiring Board
US-2016353581-A1 · Dec 1, 2016 · US
Laminating magnetic cores for on-chip magnetic devices
US-9495989-B2 · Nov 15, 2016 · US
Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens
US-2016319447-A1 · Nov 3, 2016 · US
Cyanide-free electroplating baths for white bronze based on copper (i) ions
US-2016298249-A1 · Oct 13, 2016 · US
Copper foil for printed circuit
US-2016286665-A1 · Sep 29, 2016 · US
Electrodeposition of thin-film cells containing non-toxic elements
US-9450136-B2 · Sep 20, 2016 · US
Electrodeposition of thin-film cells containing non-toxic elements
US-9447514-B2 · Sep 20, 2016 · US
Laminating magnetic cores for on-chip magnetic devices
US-2016260451-A1 · Sep 8, 2016 · US
Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens
US-9439294-B2 · Sep 6, 2016 · US
High strength, high heat resistance electrodeposited copper foil and manufacturing method for same
US-9428840-B2 · Aug 30, 2016 · US
Nitrogen containing polymers as levelers
US-2016237579-A1 · Aug 18, 2016 · US
Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys
US-9399824-B2 · Jul 26, 2016 · US
Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures
US-9401443-B2 · Jul 26, 2016 · US
Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
US-9394619-B2 · Jul 19, 2016 · US
Button or fastener member of copper-plated aluminum or aluminum alloy and method of production thereof
US-9388502-B2 · Jul 12, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D3/58?
- CPC C25D3/58 is the Cooperative Patent Classification code for “containing more than 50% by weight of copper.”
- How many patents are filed under CPC C25D3/58 (containing more than 50% by weight of copper)?
- Our database includes 220 publications tagged with this CPC code.
- Is patent activity under CPC C25D3/58 growing?
- Publication counts under this code: 14 in 2024 vs 7 in 2025 (latest complete years).