Laminating magnetic cores for on-chip magnetic devices

US2016260451A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016260451-A1
Application numberUS-201615149727-A
CountryUS
Kind codeA1
Filing dateMay 9, 2016
Priority dateFeb 6, 2013
Publication dateSep 8, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

First claim

Opening claim text (preview).

What is claimed is: 1 . An on-chip magnetic device consisting of: a first magnetic unit consisting of first and second magnetic layers and a non-magnetic spacer layer therebetween, wherein the non-magnetic spacer layer has a thickness of 5 to 20 nanometers and is selected from the group consisting of copper, molydenum, zinc, rubidium, gold, silver, selenium, tellurium, sulfur, phosphorous, gallium, chromium, rhenium, indium, tin, nickel phosphorous, nickel boron, and non-magnetic alloys thereof; at least one additional magnetic unit consisting of first and second magnetic layers and the non-magnetic spacer layer therebetween; a resistive spacer disposed between the first and the at least one additional magnetic units, wherein the resistive spacer is at a thickness of 100 nm to 1 micron and is selected from the group consisting of selenium, bismuth, tellurium, phosphorous, sulfur, germanium, antimony, and alloys thereof that can be electrochemically reduced, and wherein a total thickness of the first and second magnetic layers plus the non-magnetic spacer layer within the magnetic unit or the at least one additional magnetic unit consisting of first and second magnetic layers and the non-magnetic spacer layer therebetween is within a skin depth, wherein the skin depth is a depth below a surface of a respective magnetic layer at which current density has fallen to 1/e of surface current density.

Assignees

Inventors

Classifications

  • G11B5/66Primary

    the record carriers consisting of several layers · CPC title

  • via a non-magnetic spacer · CPC title

  • C25D5/10Primary

    Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title

  • Magnets · CPC title

  • the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ] · CPC title

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What does patent US2016260451A1 cover?
A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification G11B5/66. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Sep 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).