High strength, high heat resistance electrodeposited copper foil and manufacturing method for same

Patent metadata

Field	Value
Publication number	US-9428840-B2
Application number	US-201214353081-A
Country	US
Kind code	B2
Filing date	Oct 30, 2012
Priority date	Oct 31, 2011
Publication date	Aug 30, 2016
Grant date	Aug 30, 2016

Abstract

Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C.
Resolution Means: An electrodeposited copper alloy foil that includes a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, and a method of manufacturing same.

First claim

The invention claimed is:

1. An electrodeposited copper alloy foil comprising a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, wherein said metal that exists as an oxide in a solution at pH4 or less or said oxide of the metal is contained inside a copper matrix of said electrodeposited copper alloy.

2. The electrodeposited copper alloy foil according to claim 1 , wherein the metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal is included in a range of 10 to 2610 ppm as the metal.

3. The electrodeposited copper alloy foil according to claim 1 , wherein the copper matrix exists as ultra fine crystal grains, and the metal oxide of the metal is dispersed throughout the copper matrix as ultra fine particles.

4. The electrodeposited copper alloy foil according to claim 1 wherein the metal that exists as an oxide in a solution at pH4 or less is at least one of W, Mo, Ti, and Te.

5. The electrodeposited copper alloy foil according to claim 1 , wherein an electrical conductivity is 65% IACS or higher.

6. The electrodeposited copper alloy foil according to claim 1 , wherein a value of tensile strength under normal conditions is 500 MPa or higher, and a value of tensile strength after heat treatment at 300° C. as a percentage of the value of tensile strength under normal conditions is 80% or higher.

7. The electrodeposited copper alloy foil according to claim 1 , manufactured using electrolyte that includes an aqueous solution of copper sulfate, an aqueous solution of a metal salt of the above-mentioned metal, and chloride ion at not more than 3 mg/L.

8. A method of manufacturing the electrodeposited copper alloy foil according to claim 1 , comprising: preparing an electrolyte by adding hydrochloric acid or a water soluble chlorine-containing compound to a mixture of an aqueous solution of copper sulfate and an aqueous solution of a metal salt of the above-mentioned metal, so that a chloride ion concentration is not more than 3 mg/L; and manufacturing the electrodeposited copper alloy foil by electrolytic deposition using the electrolyte.

9. An electrodeposited copper alloy foil comprising a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, having a chlorine content less than 10 ppm, wherein said metal that exists as an oxide in a solution at pH4 or less or said oxide of the metal is contained inside a copper matrix of said electrodeposited copper alloy.

10. The electrodeposited copper alloy foil according to claim 9 , wherein the metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal is included in a range of 10 to 2610 ppm as the metal.

11. The electrodeposited copper alloy foil according to claim 9 , wherein the copper matrix exists as ultra fine crystal grains, and the metal oxide of the metal is dispersed throughout the copper matrix as ultra fine particles.

12. The electrodeposited copper alloy foil according to claim 9 wherein the metal that exists as an oxide in a solution at pH4 or less is at least one of W, Mo, Ti, and Te.

13. The electrodeposited copper alloy foil according to claim 9 , wherein an electrical conductivity is 65% IACS or higher.

14. The electrodeposited copper alloy foil according to claim 9 , wherein a value of tensile strength under normal conditions is 500 MPa or higher, and a value of tensile strength after heat treatment at 300° C. as a percentage of the value of tensile strength under normal conditions is 80% or higher.

15. The electrodeposited copper alloy foil according to claim 9 , manufactured using electrolyte that includes an aqueous solution of copper sulfate, an aqueous solution of a metal salt of the above-mentioned metal, and chloride ion at not more than 3 mg/L.

16. A method of manufacturing the electrodeposited copper alloy foil according to claim 9 , comprising: preparing an electrolyte by adding hydrochloric acid or a water soluble chlorine-containing compound to a mixture of an aqueous solution of copper sulfate and an aqueous solution of a metal salt of the above-mentioned metal, so that a chloride ion concentration is not more than 3 mg/L; and manufacturing the electrodeposited copper alloy foil by electrolytic deposition using the electrolyte.

17. An electrodeposited copper alloy foil comprising a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, having a chlorine content less than 1 ppm, wherein said metal that exists as an oxide in a solution at pH4 or less or said oxide of the metal is contained inside a copper matrix of said electrodeposited copper alloy.

18. The electrodeposited copper alloy foil according to claim 17 , wherein the metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal is included in a range of 10 to 2610 ppm as the metal.

19. The electrodeposited copper alloy foil according to claim 17 , wherein the copper matrix exists as ultra fine crystal grains, and the metal oxide of the metal is dispersed throughout the copper matrix as ultra fine particles.

20. The electrodeposited copper alloy foil according to claim 17 , wherein the metal that exists as an oxide in a solution at pH4 or less is at least one of W, Mo, Ti, and Te.

21. The electrodeposited copper alloy foil according to claim 17 , wherein an electrical conductivity is 65% IACS or higher.

22. The electrodeposited copper alloy foil according to claim 17 , wherein a value of tensile strength under normal conditions is 500 MPa or higher, and a value of tensile strength after heat treatment at 300° C. as a percentage of the value of tensile strength under normal conditions is 80% or higher.

23. The electrodeposited copper alloy foil according to claim 17 , manufactured using electrolyte that includes an aqueous solution of copper sulfate, an aqueous solution of a metal salt of the above-mentioned metal, and chloride ion at not more than 3 mg/L.

24. A method of manufacturing the electrodeposited copper alloy foil according to claim 17 , comprising: preparing an electrolyte by adding hydrochloric acid or a water soluble chlorine-containing compound to a mixture of an aqueous solution of copper sulfate and an aqueous solution of a metal salt of the above-mentioned metal, so that a chloride ion concentration is not more than 3 mg/L; and manufacturing the electrodeposited copper alloy foil by electrolytic deposition using the electrolyte.

25. An electrodeposited copper alloy foil comprising tungsten, the remainder being copper and unavoidable impurities, wherein said tungsten is contained inside a copper matrix of said electrodeposited copper alloy foil.

26. A method of manufacturing an electrodeposited copper alloy foil according to claim 25 , comprising: obtaining an electrolyte by mixing an aqueous solution of a tungsten salt to a sulfuric acid-copper sulfate electrolyte that includes not more than 3 mg/L chloride ion; and manufacturing the electrodeposited copper alloy foil by electrolytic deposition using the electrolyte.

27. An electrodeposited copper alloy foil comprising tungsten in a range of 10 to 2000 ppm, the remainder being copper and unavoidable impurities, wherein said tungsten is contained inside a copper matrix of said electrodeposited copper alloy foil.

28. A method of manufacturing an electrodeposited copper alloy foil according to claim 27 , comprising: obtaini

Assignees

• Furukawa Electric Co Ltd

Inventors

• Ezura Takeshi
• Suzuki Akitoshi
• Shinozaki Kensaku
• Sasaki Hirokazu
• Yamazaki Satoshi

Classifications

• C25D3/58

  containing more than 50% by weight of copper · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• C25D1/04 Primary

  Wires; Strips; Foils · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C25D3/38

  of copper · CPC title