Sulfonamide based polymers for copper electroplating

Patent metadata

Field	Value
Publication number	US-9562300-B2
Application number	US-201514980562-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Dec 30, 2014
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.

First claim

What is claimed is:

1. A method comprising:
a) providing a substrate;
b) providing a composition comprising one or more sources of copper ions, optionally one or more sources of tin ions, an electrolyte and a reaction product comprising: one or more sulfonamides or salts thereof, and one or more epoxides;
c) contacting a substrate with the composition;
d) applying a current to the substrate and the composition; and
e) depositing a copper or copper/tin alloy on the substrate.

2. The method of claim 1 , wherein the substrate comprises a plurality of one or more of through-holes, trenches and vias.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Lu Weijing
• Niazimbetova Zuhra I
• Rzeznik Maria Anna

Classifications

• C07D303/20

  Ethers with hydroxy compounds containing no oxirane rings · CPC title

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• H05K3/241

  characterised by the electroplating method; means therefor, e.g. baths or apparatus · CPC title

• C07C311/17

  to an acyclic carbon atom of a hydrocarbon radical substituted by singly-bound oxygen atoms · CPC title

• H05K3/188

  by direct electroplating · CPC title