Stripping solution for zinc/nickel alloy plating from metal substrate
US-9797048-B2 · Oct 24, 2017 · US
Compositions for etching metallic material from a metallic material substrate of different composition
Compositions for etching metallic material from a metallic material substrate of different composition · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23F1/44 |
| Official title | Compositions for etching metallic material from a metallic material substrate of different composition |
| Display label | Compositions for etching metallic material from a metallic material substrate of different composition |
| Total patents | 258 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 29 |
| 2017 | 12 |
| 2018 | 19 |
| 2019 | 14 |
| 2020 | 34 |
| 2021 | 27 |
| 2022 | 30 |
| 2023 | 17 |
| 2024 | 29 |
| 2025 | 17 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for adhering metal layer and polymer layer and method for manufacturing metal electrode
US-2017173933-A1 · Jun 22, 2017 · US
Etching solution for copper or a compound comprised mainly of copper
US-9644274-B2 · May 9, 2017 · US
Etching liquid, etching method, and method of manufacturing solder bump
US-9633898-B2 · Apr 25, 2017 · US
Pre-treatment process for electroless plating
US-2016348246-A1 · Dec 1, 2016 · US
Method for Forming Projections and Depressions, Sealing Structure, and Light-Emitting Device
US-2016322608-A1 · Nov 3, 2016 · US
Liquid composition used in etching multilayer film containing copper and molybdenum, manufacturing method of substrate using said liquid composition, and substrate manufactured by said manufacturing method
US-9466508-B2 · Oct 11, 2016 · US
Stripping Solution for Zinc/Nickel Alloy Plating from Metal Substrate
US-2016289614-A1 · Oct 6, 2016 · US
Method for surface-modifying neural electrode
US-2016258070-A1 · Sep 8, 2016 · US
Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
US-2016222523-A1 · Aug 4, 2016 · US
Method of selectively treating copper in the presence of further metal
US-2016222519-A1 · Aug 4, 2016 · US
Method for forming projections and depressions, sealing structure, and light-emitting device
US-9394614-B2 · Jul 19, 2016 · US
Semiconductor device with reduced via resistance
US-2016204069-A1 · Jul 14, 2016 · US
Semiconductor device with reduced via resistance
US-2016197010-A1 · Jul 7, 2016 · US
Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
US-2016168722-A1 · Jun 16, 2016 · US
Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate
US-9365934-B2 · Jun 14, 2016 · US
Etchant composition and method of forming metal wire and thin film transistor array panel using the same
US-9347125-B2 · May 24, 2016 · US
Methods of removing a protective layer
US-9347139-B2 · May 24, 2016 · US
Semiconductor device with reduced via resistance
US-9349691-B2 · May 24, 2016 · US
Process for etching a recessed structure filled with tin or a tin alloy
US-9332652-B2 · May 3, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23F1/44?
- CPC C23F1/44 is the Cooperative Patent Classification code for “Compositions for etching metallic material from a metallic material substrate of different composition.”
- How many patents are filed under CPC C23F1/44 (Compositions for etching metallic material from a metallic material substrate of different composition)?
- Our database includes 258 publications tagged with this CPC code.
- Is patent activity under CPC C23F1/44 growing?
- Publication counts under this code: 29 in 2024 vs 17 in 2025 (latest complete years).