Method for Forming Projections and Depressions, Sealing Structure, and Light-Emitting Device

Patent metadata

Field	Value
Publication number	US-2016322608-A1
Application number	US-201615211444-A
Country	US
Kind code	A1
Filing date	Jul 15, 2016
Priority date	Apr 19, 2013
Publication date	Nov 3, 2016
Grant date	—

Abstract

A novel method for forming projections and depressions is provided. A novel sealing structure is provided. A novel light-emitting device is provided. A first step of forming a film containing at least two kinds of metals having different etching rates over a surface; a second step of heating the film so that the metal having a lower etching rate segregates; a third step of selectively etching the metal having a higher etching rate; and a fourth step of selectively etching the surface using a residue containing the metal having a lower etching rate are included.

First claim

1 - 5 . (canceled)

6 . A sealing structure comprising:
a substrate; a sealing substrate opposite a surface of the substrate; a sealant between the substrate and the sealing substrate; and a sealed structure sealed in a region surrounded by the substrate, the sealing substrate, and the sealant, wherein the surface of the substrate is provided with:
projections and depressions;
a surface being adjacent to the projections and depressions and being flatter and smoother than the projections and depressions; and
a first film overlapping the flat and smooth surface, and
wherein the sealant is in contact with the projections and depressions.

7 . The sealing structure according to claim 6 ,
wherein a surface of the sealing substrate is provided with:
projections and depressions;
a surface being adjacent to the projections and depressions of the sealing substrate and being flatter and smoother than the projections and depressions of the sealing substrate; and
a second film overlapping the flat and smooth surface.

8 . The sealing structure according to claim 7 wherein the sealant contains glass whose melting point is higher than or equal to 300° C. and lower than or equal to 700° C.

9 . The sealing structure according to claim 7 ,
wherein the sealant is in contact with the second film which the sealing substrate is provided with.

10 . The sealing structure according to claim 7 ,
wherein the substrate comprises at least one of glass, ceramics, a metal, an inorganic material, and a resin.

11 . The sealing structure according to claim 7 ,
wherein the sealing substrate comprises at least one of glass, ceramics, a metal, an inorganic material, and a resin.

12 . An electronic device comprising the sealing structure according to claim 8 .

13 . A light-emitting device comprising:
a substrate; a sealing substrate opposite a surface of the substrate; a sealant between the substrate and the sealing substrate; and a light-emitting element sealed in a region surrounded by the substrate, the sealing substrate, and the sealant, wherein the surface of the substrate is provided with:
projections and depressions;
a surface being adjacent to the projections and depressions and being flatter and smoother than the projections and depressions; and
a conductive film overlapping the surface,
wherein the light-emitting element is electrically connected to the conductive film, and wherein the sealant is adjacent to the projections and depressions.

14 . The light-emitting device according to claim 13 ,
wherein the substrate comprises at least one of glass, ceramics, a metal, an inorganic material, and a resin.

15 . The light-emitting device according to claim 13 ,
wherein the sealing substrate comprises at least one of glass, ceramics, a metal, an inorganic material, and a resin.

16 . An electronic device comprising the light-emitting device according to claim 13 .

17 . (canceled)

Assignees

• Semiconductor Energy Lab

Inventors

• Nishido Yusuke

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• C23F1/12

  Gaseous compositions · CPC title

• Y10T428/24355

  Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title

• C23F1/44

  Compositions for etching metallic material from a metallic material substrate of different composition · CPC title