Etching solution for copper or a compound comprised mainly of copper

Patent metadata

Field	Value
Publication number	US-9644274-B2
Application number	US-201214130779-A
Country	US
Kind code	B2
Filing date	Jun 28, 2012
Priority date	Jul 4, 2011
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

The present invention relates to an etching solution for copper or a compound comprised mainly of copper, wherein the etching solution contains (A) a maleic acid ion source and (B) a copper ion source, and an etching method using the etching solution.

First claim

The invention claimed is:

1. An etching method, comprising:
etching an object comprising copper or a compound comprised mainly of copper by contacting the object with an etching solution comprising:
(A) a maleic acid ion source,
(B) a copper ion source, and
(C) a source of an organic acid ion comprising two or more carboxyl groups and one or more hydroxyl groups per molecule,
wherein
the source of the organic acid ion comprising two or more carboxyl groups and one or more hydroxyl groups per molecule (C) is at least one selected from the group consisting of citric acid, malic acid, and a salt thereof, and
the etching solution does not comprise tartaric acid, a halide ion, or hydrogen peroxide.

2. The etching method of claim 1 , wherein the maleic acid ion source (A) is at least one selected from the group consisting of maleic acid, maleic anhydride, and an alkali metal maleate.

3. The etching method of claim 1 , wherein the copper ion source (B) is at least one selected from the group consisting of copper, copper hydroxide, copper sulfate, and copper nitrate.

4. The etching method of claim 1 , wherein a concentration of maleic acid ion in the etching solution is 0.01 to 2 mol/kg, a concentration of copper ion in the etching solution is 0.01 to 1 mol/kg, and a molar ratio of the concentration of maleic acid ion to the concentration of copper ion is in a range of 0.01 to 50.

5. The etching method of claim 1 , wherein a molar ratio of an amount of the source of the organic acid ion comprising two or more carboxyl groups and one or more hydroxyl groups per molecule (C) to an amount of the copper ion source (B) is in a range of 0.1 to 2.0.

6. The etching method of claim 1 , wherein the etching solution further comprises a pH adjustor.

7. The etching method of claim 1 , wherein the etching solution has a pH of 0 to 9.

8. The etching method of claim 1 , wherein the etching solution further comprises (D) an ammonia source, an ammonium ion source, or both.

9. The etching method of claim 1 , wherein the etching solution further comprises (E) a molybdenum source, a molybdic acid ion source, or both.

10. The etching method according to claim 1 , wherein
the object is a film comprising copper or the compound comprised mainly of copper, and
the film constitutes one layer of a multilayer film.

11. The etching method according to claim 10 , wherein the multilayer film
has a two-layer structure comprising the film comprising copper or the compound comprised mainly of copper and a film comprising molybdenum or a compound comprised mainly of molybdenum, or
has a three-layer structure comprising a first film comprising molybdenum or a compound comprised mainly of molybdenum, the film comprising copper or the compound comprised mainly of copper, and a second film comprising molybdenum or a compound comprised mainly of molybdenum.

Assignees

• Tamai Satoshi
• Yube Kunio
• Okabe Satoshi
• Mitsubishi Gas Chemical Co

Inventors

• Tamai Satoshi
• Yube Kunio
• Okabe Satoshi

Classifications

• H10P50/667

  by liquid etching only · CPC title

• H05K3/067

  Etchants · CPC title

• C09K13/04

  containing an inorganic acid · CPC title

• C23F1/16

  Acidic compositions (C23F1/42 takes precedence) · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title