Plated lead frame including doped silver layer
US-2017365759-A1 · Dec 21, 2017 · US
Coating with alloys
Coating with alloys · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/48 |
| Official title | Coating with alloys |
| Display label | Coating with alloys |
| Total patents | 158 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 26 |
| 2017 | 27 |
| 2018 | 16 |
| 2019 | 14 |
| 2020 | 11 |
| 2021 | 10 |
| 2022 | 10 |
| 2023 | 10 |
| 2024 | 8 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plated lead frame including doped silver layer
US-9847468-B1 · Dec 19, 2017 · US
Plating bath compositions for electroless plating of metals and metal alloys
US-2017327954-A1 · Nov 16, 2017 · US
Method for producing metal-plated stainless material
US-2017327953-A1 · Nov 16, 2017 · US
Method of electroless deposition of aluminum or aluminum alloy, an electroless plating composition, and an article including the same
US-9803283-B1 · Oct 31, 2017 · US
Manufacturing method of substrate structure, substrate structure and metal component
US-9790609-B2 · Oct 17, 2017 · US
Method of producing hot-dip zn alloy-plated steel sheet
US-2017260614-A1 · Sep 14, 2017 · US
Method for processing resin product and resin product
US-9745428-B2 · Aug 29, 2017 · US
Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device
US-2017245372-A1 · Aug 24, 2017 · US
Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes
US-2017171982-A1 · Jun 15, 2017 · US
Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes
US-2017171987-A1 · Jun 15, 2017 · US
Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes
US-2017171988-A1 · Jun 15, 2017 · US
Pre-treatment method for plating and storage medium
US-9653350-B2 · May 16, 2017 · US
Metal nanowire thin-films
US-2017127515-A1 · May 4, 2017 · US
Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate
US-2017073815-A1 · Mar 16, 2017 · US
Blister packages
US-2017001781-A1 · Jan 5, 2017 · US
Plating method, plated component, and plating system
US-2016372367-A1 · Dec 22, 2016 · US
Method for manufacturing fuel cell separator
US-9515324-B2 · Dec 6, 2016 · US
Metal Plate Coated Stainless Material and Method of Producing Metal Plate Coated Stainless Material
US-2016340786-A1 · Nov 24, 2016 · US
Stable catalysts for electroless metallization
US-2016332153-A1 · Nov 17, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/48?
- CPC C23C18/48 is the Cooperative Patent Classification code for “Coating with alloys.”
- How many patents are filed under CPC C23C18/48 (Coating with alloys)?
- Our database includes 158 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/48 growing?
- Publication counts under this code: 8 in 2024 vs 8 in 2025 (latest complete years).