Light-emitting device and method for producing the same
US-2016233387-A1 · Aug 11, 2016 · US
Plated lead frame including doped silver layer
US9847468B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9847468-B1 |
| Application number | US-201615187314-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jun 20, 2016 |
| Priority date | Jun 20, 2016 |
| Publication date | Dec 19, 2017 |
| Grant date | Dec 19, 2017 |
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- Title
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Abstract
Official abstract text for this publication.
A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.
First claim
Opening claim text (preview).
The invention claimed is: 1. Method of manufacturing a lead frame, comprising the steps of: providing a substrate comprising copper; plating a layer of bright silver onto the substrate; after plating the layer of bright silver onto the substrate, plating a layer of doped bright silver over a top surface of the layer of bright silver; and plating a layer of copper onto the substrate prior to plating the layer of bright silver, such that the layer of bright silver is plated over the layer of copper; wherein the step of plating the layer of copper is conducted in an aqueous solution comprising copper sulfate, a brightener, a leveler and a carrier. 2. Method of manufacturing a lead frame as claimed in claim 1 , wherein the carrier comprises Polyethylene Glycol (PEG) or Polyalkylene Glycol. 3. Method of manufacturing a lead frame, comprising the steps of: providing a substrate comprising copper; plating a layer of bright silver onto the substrate; after plating the layer of bright silver onto the substrate, plating a layer of doped bright silver over a top surface of the layer of bright silver; and plating a layer of nickel prior to plating the layer of bright silver, such that the layer of bright silver is plated over the layer of nickel; wherein the step of plating the layer of nickel is conducted in an aqueous solution comprising nickel sulfamate, nickel chloride and boric acid. 4. Method of manufacturing a lead frame, comprising the steps of: providing a substrate comprising copper; plating a layer of bright silver onto the substrate; and thereafter plating a layer of doped bright silver over a top surface of the layer of bright silver; wherein the step of plating the layer of bright silver is conducted in an aqueous solution comprising potassium silver cyanide, potassium cyanide, a brightener, and potassium phosphate. 5. Method of manufacturing a lead frame as claimed in claim 4 , wherein the dopant used for doping the layer of doped bright silver comprises palladium. 6. Method of manufacturing a lead frame as claimed in claim 5 , wherein the step of plating the layer of doped bright silver is conducted in an aqueous solution comprising ammonium tetrachloropalladate and ammonium phosphate. 7. Method of manufacturing a lead frame as claimed in claim 5 , wherein the step of plating the layer of doped bright silver is conducted in an aqueous solution comprising ammonium tetrachloropalladate, ammonium phosphate, and a brightener. 8. Method of manufacturing a lead frame as claimed in claim 4 , wherein the dopant used for doping the layer of doped bright silver comprises gold. 9. Method of manufacturing a lead frame as claimed in claim 8 , wherein the step of plating the layer of doped bright silver is conducted in an aqueous solution comprising potassium gold cyanide and potassium phosphate.
Assignees
Inventors
Classifications
using a liquid · CPC title
of metallic layers on leadframes · CPC title
of leadframes · CPC title
- H10W70/40Primary
Leadframes · CPC title
Two or more layers only obtained by electroless plating · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9847468B1 cover?
- A lead frame comprises a substrate comprising copper and includes a layer of bright silver is plated onto the substrate. A layer of doped bright silver is thereafter plated over a top surface of the layer of bright silver for enhancing the performance of LED devices utilizing the lead frame.
- Who is the assignee on this patent?
- Asm Tech Singapore Pte Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/40. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).