Method for processing resin product and resin product

US9745428B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9745428-B2
Application numberUS-201414455324-A
CountryUS
Kind codeB2
Filing dateAug 8, 2014
Priority dateAug 9, 2013
Publication dateAug 29, 2017
Grant dateAug 29, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for processing a resin product, the method comprising: irradiating a portion of a surface of the resin product with an ultraviolet laser beam to modify the portion; and after the irradiating, oxidizing a region including the portion to further modify the portion such that a plating metal can be deposited on the portion. 2. The method according to claim 1 , wherein the portion is irradiated with the ultraviolet laser beam having a wavelength of not more than 243 nm. 3. The method according to claim 1 , wherein the portion is irradiated with the ultraviolet light laser beam in an atmosphere containing at least one of oxygen or ozone. 4. The method according to claim 1 , wherein oxidizing the region includes irradiating the region with ultraviolet light having a wavelength of not more than 243 nm. 5. The method according to claim 4 , wherein the portion is irradiated with the ultraviolet light laser beam in an atmosphere containing at least one of oxygen or ozone, and the region is irradiated with the ultraviolet light in an atmosphere containing at least one of oxygen or ozone. 6. The method according to claim 1 , wherein the oxidized region includes the irradiated portion and is wider than the irradiated portion. 7. The method according to claim 1 , wherein an oxygen atom existence ratio in the portion is not less than 3.0% after the irradiating. 8. The method according to claim 1 , wherein an oxygen atom existence ratio in the portion is not less than 18% after the irradiating and oxidizing. 9. The method according to claim 1 , wherein the resin product has a resin coating. 10. The method according to claim 1 , wherein the surface of the resin product contains a cycloolefin polymer. 11. The method according to claim 1 , further comprising: plating the resin product on which the modification process is performed to manufacture a resin product with a metal film. 12. The method according to claim 11 , wherein the plating metal is deposited on the portion on which the modification process is performed, and no plating metal is deposited on a portion adjacent to the portion on which the modification process is performed. 13. A method for processing a resin product, comprising: irradiating a portion of a surface of the resin product with an ultraviolet laser beam having a wavelength of not more than 243 nm; and after the irradiating, oxidizing a region including the portion to modify the portion such that a plating metal can be deposited on the portion. 14. The method according to claim 11 , further comprising manufacturing a circuit board using the resin product with the metal film. 15. The method according to claim 11 , wherein the plating includes depositing a metal film on a surface of one portion of the resin product which is recessed from a surface of another portion of the resin product adjacent to the one portion. 16. The method according to claim 1 , further comprising changing a processing environment around the resin product from a first processing environment to a second processing environment, wherein the irradiating is performed in the first processing environment and the oxidizing is performed in the second processing environment. 17. The method according to claim 1 , wherein, in the irradiating, the portion is irradiated with a first ultraviolet laser beam, and wherein, in the oxidizing, the region is irradiated with ultraviolet light having different energy than the first ultraviolet laser beam. 18. The method according to claim 1 , wherein a degree of oxidation at the portion is increased by the irradiating, and a degree of oxidation at the region is increased by the oxidizing. 19. The method according to claim 1 , wherein the irradiating includes irradiating a selected portion of the surface of the resin product in accordance with a fine plating pattern, wherein the oxidizing includes oxidizing the region that includes the selected portion and is larger than the selected portion, and wherein the fine plating pattern includes a wire pattern. 20. The method according to claim 1 , wherein the irradiating includes irradiating the portion of the surface of the resin product with the ultraviolet laser beam having a wavelength of not more than 243 nm; and wherein the oxidizing includes irradiating the region including the portion with ultraviolet light having a wavelength of not more than 243 nm.

Assignees

Inventors

Classifications

  • Next to addition polymer from unsaturated monomers · CPC title

  • through irradiation means · CPC title

  • Radiation, e.g. UV, laser · CPC title

  • Treatment by wave energy or particle radiation (C08J7/18 takes precedence) · CPC title

  • C08J3/28Primary

    Treatment by wave energy or particle radiation · CPC title

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Frequently asked questions

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What does patent US9745428B2 cover?
There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.
Who is the assignee on this patent?
Canon Components Kk
What technology area does this patent fall under?
Primary CPC classification C08J3/28. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 29 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).