Method for improving adhesion between metallization layers and ozone-etched plastics
US-12540404-B2 · Feb 3, 2026 · US
Multistep pretreatment
Multistep pretreatment · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/2073 |
| Official title | {Multistep pretreatment} |
| Display label | Multistep pretreatment |
| Total patents | 29 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 7 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 2 |
| 2022 | 1 |
| 2023 | 2 |
| 2024 | 1 |
| 2025 | 1 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for improving adhesion between metallization layers and ozone-etched plastics
US-2025207264-A1 · Jun 26, 2025 · US
Method for manufacturing composite material to be plated and method for manufacturing anisotropic electroconductive sheet
US-2024360562-A1 · Oct 31, 2024 · US
Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US-11795546-B2 · Oct 24, 2023 · US
Method and apparatus for mass production of AR diffractive waveguides
US-11577480-B2 · Feb 14, 2023 · US
Depositing a structurally hard, wear resistant metal coating onto a substrate
US-11346001-B2 · May 31, 2022 · US
Method and apparatus for mass production of ar diffractive waveguides
US-2021197507-A1 · Jul 1, 2021 · US
Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US-2021002770-A1 · Jan 7, 2021 · US
Process for pretreatment of plastic surfaces for metallization
US-10822703-B2 · Nov 3, 2020 · US
Depositing a structurally hard, wear resistant metal coating onto a substrate
US-10787743-B2 · Sep 29, 2020 · US
Depositing a structurally hard, wear resistant metal coating onto a substrate
US-2020255950-A1 · Aug 13, 2020 · US
Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
US-10344385-B2 · Jul 9, 2019 · US
Depositing a structurally hard, wear resistant metal coating onto a substrate
US-2019062922-A1 · Feb 28, 2019 · US
Process for pretreatment of plastic surfaces for metallization
US-2018216233-A1 · Aug 2, 2018 · US
Process for metallizing plastic surfaces
US-2018202048-A1 · Jul 19, 2018 · US
Method for manufacturing wiring pattern, method for manufacturing conductive film, and method for manufacturing transistor
US-2018171482-A1 · Jun 21, 2018 · US
Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US-9914115-B2 · Mar 13, 2018 · US
Industrial products formed from plated polymers
US-2016376709-A1 · Dec 29, 2016 · US
METHOD FOR FORMING CONDUCTIVE PATTERN BY DIRECT RADIATION OF ELECTROMAGNETIC WAVE, AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN THEREON (As Amended)
US-2016212860-A1 · Jul 21, 2016 · US
Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
US-2016201198-A1 · Jul 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/2073?
- CPC C23C18/2073 is the Cooperative Patent Classification code for “Multistep pretreatment.”
- How many patents are filed under CPC C23C18/2073 (Multistep pretreatment)?
- Our database includes 29 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/2073 growing?
- Publication counts under this code: 1 in 2024 vs 1 in 2025 (latest complete years).