Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon

Patent metadata

Field	Value
Publication number	US-2016201198-A1
Application number	US-201414910633-A
Country	US
Kind code	A1
Filing date	Aug 7, 2014
Priority date	Aug 9, 2013
Publication date	Jul 14, 2016
Grant date	—

Abstract

Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers under a relatively low power by a simplified process, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed thereon.
The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing carbon-based black pigment; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

First claim

1 . A method for forming conductive pattern by direct radiation of an electromagnetic wave, the method comprising:
forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing carbon-based black pigment; forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.

2 . The method of claim 1 , wherein the carbon-based black pigment includes at least one kind selected from the group consisting of carbon black, pine black soot, soot, lamp black, channel black, furnace black, and acetylene black.

3 . The method of claim 1 , wherein the carbon-based black pigment is contained in an amount of 0.01 to 10 wt % based on a weight of the polymer resin substrate.

4 . The method of claim 1 , wherein the carbon-based black pigment is contained in a particle state having a particle diameter of 10 nm to 1 μm.

5 . The method of claim 1 , wherein when a cross-cut test having an interval of 2 mm or less according to ISO 2409 standard method is conducted by using a tape having adhesion of 4.0 to 6.0N/10 mm width, the first region of the polymer resin substrate has surface roughness defined by adhesion at which a delamination area of a target metal layer under test corresponds to 5% or less of an area of the metal layer.

6 . The method of claim 1 , wherein when a cross-cut test having an interval of 2 mm or less according to ISO 2409 standard method is conducted by using a tape having adhesion of 4.0 to 6.0N/10 mm width, the second region of the polymer resin substrate has surface roughness defined by adhesion at which a delamination area of a target metal layer under test corresponds to 65% or more of an area of the metal layer.

7 . The method of claim 1 , wherein the first region of the polymer resin substrate has surface roughness defined by a center line arithmetic average roughness of the absolute values (Ra) of 1 μm or more, and the second region has a center line arithmetic average roughness of the absolute values (Ra) smaller than that of the first region.

8 . The method of claim 1 , wherein the polymer resin substrate contains at least one kind selected from the group consisting of an ABS resin, a polyalkylene terephthalate resin, a polycarbonate resin, a polypropylene resin, and a polyphthalamide resin.

9 . The method of claim 1 , wherein the radiating of the electromagnetic wave is performed by radiating a laser electromagnetic wave under radiation condition having 2 to 20 W of an average power.

10 . The method of claim 1 , wherein the conductive seed contains metal nanoparticles, metal ions, or metal complex ions.

11 . The method of claim 10 , wherein the conductive seed contains at least one kind metal selected from the group consisting of copper (Cu), platinum (Pt), palladium (Pd), silver (Ag), gold (Au), nickel (Ni), tungsten (W), titanium (Ti), chromium (Cr), aluminum (Al), zinc (Zn), tin (Sn), lead (Pb), magnesium (Mg), manganese (Mn) and iron (Fe), ions or complex ions thereof.

12 . The method of claim 10 , wherein the forming of the conductive seed includes:
applying a dispersion liquid or solution containing the metal nanoparticles, the metal ions, or the metal complex ions on the polymer resin substrate; and precipitating and drying the metal nanoparticles or reducing and drying the metal ions or the metal complex ions to form the conductive seed in a particle form.

13 . The method of claim 12 , wherein the reducing of the metal ions or the metal complex ions is performed in the presence of at least one kind reducing agent selected from the group consisting of an alcohol-based reducing agent, an aldehyde-based reducing agent, a hypophosphite-based reducing agent, a hydrazine-based reducing agent, sodium borohydride and lithium aluminum hydride.

14 . The method of claim 12 , further comprising surface-treating the polymer resin substrate with a surfactant having surface tension lower than that of the dispersion liquid or solution, between the radiating of the electromagnetic wave and the forming of the conductive seed.

15 . The method of claim 1 , wherein the forming of the metal layer includes electroless-plating a conductive metal on the polymer resin substrate.

16 . The method of claim 1 , wherein the removing of the conductive seed and the metal layer from the second region includes applying physical power onto the polymer resin substrate by combination of one or two or more method(s) selected from the group consisting of ultrasonic radiation (sonication), liquid phase washing, liquid phase rinsing, air blowing, taping, brushing, and a method of using a manpower.

17 . A resin structure having conductive pattern comprising:
a polymer resin substrate divided into a first region formed to have surface roughness defined by a center line arithmetic average roughness of the absolute values (Ra) of 1 μm or more and a second region having surface roughness smaller than that of the first region, and containing carbon-based black pigment; and a conductive seed and a metal layer selectively formed on the first region of the polymer resin substrate.

18 . The resin structure of claim 17 , wherein the first region corresponds to a region radiated by the electromagnetic wave.

19 . The resin structure of claim 18 , wherein the polymer resin substrate of the second region does not have a peak derived from copper (Cu) or a compound containing copper on an XRD pattern.

Assignees

• Lg Chemical Ltd

Inventors

• Kim Jae Hyun
• Seong Eun Kyu
• Lee Su Jeong
• Kim Jae Jin
• Park Cheol-Hee
• Park Chee-Sung
• Jun Shin Hee
• Jung Sang Yun
• Jeong Han Nah

Classifications

• H01B5/16

  comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24) · CPC title

• H01B13/01236

  the wires being disposed by machine · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title