Surface treating apparatus
US-10513779-B2 · Dec 24, 2019 · US
Supporting devices for articles to be coated
Supporting devices for articles to be coated · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/163 |
| Official title | {Supporting devices for articles to be coated} |
| Display label | Supporting devices for articles to be coated |
| Total patents | 126 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 14 |
| 2017 | 17 |
| 2018 | 13 |
| 2019 | 13 |
| 2020 | 14 |
| 2021 | 10 |
| 2022 | 17 |
| 2023 | 7 |
| 2024 | 9 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and apparatus for processing a substrate
US-10508352-B2 · Dec 17, 2019 · US
Selectively plated rolls of materials and related methods
US-10492348-B2 · Nov 26, 2019 · US
Wafer-like substrate processing method and apparatus
US-2019341287-A1 · Nov 7, 2019 · US
Surface treating apparatus
US-10435778-B2 · Oct 8, 2019 · US
Selectively Plated Rolls Of Materials And Related Methods
US-2019281735-A1 · Sep 12, 2019 · US
Semiconductor-manufacturing apparatus and method for manufacturing semiconductor device
US-2019267256-A1 · Aug 29, 2019 · US
Forming method of hard mask
US-2019157083-A1 · May 23, 2019 · US
Plating method
US-10287688-B2 · May 14, 2019 · US
Forming method of hard mask, forming apparatus of hard mask and recording medium
US-10224202-B2 · Mar 5, 2019 · US
Substrate transporting apparatus, control apparatus for substrate transporting apparatus, displacement compensation method for substrate transporting apparatus, program for implementing method and recording medium that records program
US-2018282893-A1 · Oct 4, 2018 · US
Metallization of the wafer edge for optimized electroplating performance on resistive substrates
US-10079207-B2 · Sep 18, 2018 · US
Plating apparatus
US-10077504-B2 · Sep 18, 2018 · US
Method and apparatus for processing a substrate
US-2018179656-A1 · Jun 28, 2018 · US
Surface treating apparatus
US-2018117618-A1 · May 3, 2018 · US
Surface treating apparatus
US-2018100237-A1 · Apr 12, 2018 · US
Air skive with vapor injection
US-9938614-B2 · Apr 10, 2018 · US
Liquid ejection hole configuration for web guide
US-9937705-B2 · Apr 10, 2018 · US
Surface treating apparatus
US-2018087140-A1 · Mar 29, 2018 · US
Liquid ejection hole orientation for web guide
US-9925761-B2 · Mar 27, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/163?
- CPC C23C18/163 is the Cooperative Patent Classification code for “Supporting devices for articles to be coated.”
- How many patents are filed under CPC C23C18/163 (Supporting devices for articles to be coated)?
- Our database includes 126 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/163 growing?
- Publication counts under this code: 9 in 2024 vs 6 in 2025 (latest complete years).