Plating method

Patent metadata

Field	Value
Publication number	US-10287688-B2
Application number	US-201615051746-A
Country	US
Kind code	B2
Filing date	Feb 24, 2016
Priority date	Mar 6, 2015
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

A plating method has an electroless plating step for forming a conductive coating on a non-conductive substrate and an electrolytic plating step for forming a metallic coating on the conductive coating by using an auxiliary electrode. In the electroless plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate, the non-conductive substrate and the auxiliary electrode are both immersed in an electroless plating solution to form the conductive coating. In the electrolytic plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate, the non-conductive substrate and the auxiliary electrode are both immersed in an electrolytic plating solution to form the metallic coating. In the electroless plating step, electric current is applied by using the auxiliary electrode as an anode and a conductive member immersed in the electroless plating solution as a cathode.

First claim

The invention claimed is:

1. A plating method comprising:
an electroless plating step for forming a conductive coating on a non-conductive substrate; and
an electrolytic plating step for forming a metallic coating on the conductive coating by using an auxiliary electrode, which is arranged to conform to a shape of the non-conductive substrate by a jig, the jig being connected to both the non-conductive substrate and the auxiliary electrode, wherein
in the electroless plating step, with a position of the auxiliary electrode adjusted in relation to the non-conductive substrate using the jig, the non-conductive substrate and the auxiliary electrode are both immersed in an electroless plating solution to form the conductive coating, and an electric current is applied while using the auxiliary electrode as an anode and a conductive member immersed in the electroless plating solution as a cathode and without the jig being directly and electrically connected to either of the anode and the cathode, and then
in the electrolytic plating step performed after the electroless plating step, with the position of the auxiliary electrode adjusted in relation to the non-conductive substrate using the jig, the non-conductive substrate and the auxiliary electrode are both immersed in an electrolytic plating solution to form the metallic coating on the conductive coating formed in the electroless plating step, and the electric current is applied while using the auxiliary electrode as the anode and a metal plate immersed in the electrolytic plating solution as the anode and with the jig being directly and electrically connected to the cathode.

2. The plating method according to claim 1 , wherein, in the electrolytic plating step, the metal plate immersed in the electrolytic plating solution as the anode is a copper plate.

3. The plating method according to claim 1 , wherein
the jig, the non-conductive substrate and the auxiliary electrode are integrated into an integrated object, and
the integrated object is transferred between the electroless plating step and the electrolytic plating step.

4. The plating method according to claim 1 , wherein
the electroless plating step is performed free of the jig being connected by electrical wiring to either of the anode and the cathode, and
the electrolytic plating step is performed with the jig being connected to the cathode by electrical wiring.

5. A plating method comprising:
an electroless plating step for forming a conductive coating on a non-conductive substrate; and
an electrolytic plating step for forming a metallic coating on the conductive coating by using an auxiliary electrode, wherein
prior to the electroless plating step, a position of the auxiliary electrode is adjusted to conform with a shape of the non-conductive substrate by a jig, the jig being connected to both the auxiliary electrode and the non-conductive substrate,
in the electroless plating step, with the position of the auxiliary electrode being adjusted to conform with the shape of the non-conductive substrate using the jig, immersing both the auxiliary electrode and the non-conductive substrate into an electroless plating solution and forming the conductive coating, while applying an electric current to the electroless plating solution using the auxiliary electrode as an anode and a conductive member immersed in the electroless plating solution as a cathode and without the jig being directly and electrically connected to either of the anode or the cathode, and
in the electrolytic plating step, with the position of the auxiliary electrode being adjusted to conform with the shape of the non-conductive substrate using the jig, immersing both the auxiliary electrode and the non-conductive substrate into an electrolytic plating solution and forming the metallic coating on the conductive coating formed in the electroless plating step while applying the electric current to the electrolytic plating solution using the auxiliary electrode as the anode and a metal plate immersed in the electrolytic plating solution as the anode and while the jig is directly and electrically connected to the cathode.

6. The plating method according to claim 5 , wherein
in the electrolytic plating step, the metal plate immersed in the electrolytic plating solution as the anode is a copper plate.

7. The plating method according to claim 5 , wherein
the jig, the auxiliary electrode and the non-conductive substrate are combined together into an integrated object with the position of the auxiliary electrode adjusted to conform with a shape of the non-conductive substrate, and
the integrated object is transferred between the electroless plating step and the electrolytic plating step.

8. The plating method according to claim 5 , wherein
the electroless plating step is performed free of the jig being connected by electrical wiring to either of the anode and the cathode, and

the electrolytic plating step is performed with the jig being connected to the cathode by electrical wiring.

Assignees

• Toyoda Gosei Kk

Inventors

• Hiei Takao
• Kawahara Atsushi

Classifications

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• C23C18/285

  Sensitising or activating with tin based compound or composition · CPC title

• C23C28/023

  only coatings of metal elements only · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title