Method and apparatus for processing a substrate

Patent metadata

Field	Value
Publication number	US-10508352-B2
Application number	US-201715849371-A
Country	US
Kind code	B2
Filing date	Dec 20, 2017
Priority date	Dec 28, 2016
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.

First claim

What is claimed is:

1. A method of processing a surface of a substrate while holding the substrate with a substrate holder including a first holding member and a second holding member, the second holding member having an opening, said method comprising:
holding the substrate with the substrate holder by sandwiching the substrate between the first holding member and the second holding member, with the surface of the substrate being exposed through the opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate to form an internal space in the substrate holder;
pressing a sealing block against the substrate holder to cover the sealing ridge, to form an external space defined by the substrate holder, the exposed surface of the substrate, and the sealing block;
forming a vacuum in the external space to create a pressure difference between the internal space and the external space;
performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and
performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.

2. The method according to claim 1 , wherein the seal inspection and the pre-wetting treatment are performed successively in a pre-wetting tank.

3. The method according to claim 1 , wherein the seal inspection and the pre-wetting treatment are performed while keeping the substrate holder, holding the substrate, in a vertical position.

4. The method according to claim 1 , further comprising:
re-forming a vacuum in the external space after the seal inspection and before the pre-wetting treatment; and
checking a sealed state provided by the sealing block based on a change in pressure in the external space.

5. The method according to claim 1 , further comprising:
discharging the pre-wetting liquid from the external space after the pre-wetting treatment; and then
performing a pretreatment by supplying a pretreatment liquid to the external space to bring the pretreatment liquid into contact with the exposed surface of the substrate.

6. The method according to claim 5 , wherein the seal inspection, the pre-wetting treatment, and the pretreatment are performed successively in a pre-wetting tank.

7. The method according to claim 1 , further comprising:
before the pre-wetting treatment, forming a vacuum in the internal space while the vacuum is formed in the external space for preventing breakage of the substrate.

Assignees

• Ebara Corp

Inventors

• Okuzono Takahisa
• Fujikata Jumpei

Classifications

• C25D17/004

  Sealing devices · CPC title

• C25D21/08

  Rinsing · CPC title

• C23C18/1827

  only one step pretreatment · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title