Slurry composition for chemical mechanical polishing of Ge-based materials and devices
US-9530655-B2 · Dec 27, 2016 · US
Aqueous dispersions (C09G1/02 takes precedence)
Aqueous dispersions (C09G1/02 takes precedence) · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09G1/04 |
| Official title | Aqueous dispersions (C09G1/02 takes precedence) |
| Display label | Aqueous dispersions (C09G1/02 takes precedence) |
| Total patents | 503 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 39 |
| 2016 | 41 |
| 2017 | 46 |
| 2018 | 39 |
| 2019 | 63 |
| 2020 | 54 |
| 2021 | 79 |
| 2022 | 53 |
| 2023 | 30 |
| 2024 | 40 |
| 2025 | 18 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polishing composition containing ceria abrasive
US-9505952-B2 · Nov 29, 2016 · US
Ni:nige:ge selective etch formulations and method of using same
US-2016314990-A1 · Oct 27, 2016 · US
Cmp composition and method for polishing rigid disks
US-2016288290-A1 · Oct 6, 2016 · US
Kit for polishing sapphire surfaces
US-9446493-B2 · Sep 20, 2016 · US
Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si1-xGex material in the presence of a CMP composition comprising a specific organic compound
US-9443739-B2 · Sep 13, 2016 · US
Colloidal silica chemical-mechanical polishing composition
US-9422456-B2 · Aug 23, 2016 · US
Dishing reducing in tungsten chemical mechanical polishing
US-2016237315-A1 · Aug 18, 2016 · US
Cmp composition for silicon nitride removal
US-2016222254-A1 · Aug 4, 2016 · US
Polishing composition and method for producing same
US-2016215188-A1 · Jul 28, 2016 · US
Polishing composition and method for producing same
US-2016215189-A1 · Jul 28, 2016 · US
Polishing composition for edge roll-off improvement
US-9401104-B2 · Jul 26, 2016 · US
Polishing composition
US-2016153095-A1 · Jun 2, 2016 · US
Compositions and methods for CMP of silicon oxide, silicon nitride, and polysilicon materials
US-9303187-B2 · Apr 5, 2016 · US
Mixed abrasive tungsten CMP composition
US-9303190-B2 · Apr 5, 2016 · US
Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications
US-9305806-B2 · Apr 5, 2016 · US
Slurry composition for chemical mechanical polishing of ge-based materials and devices
US-2016071737-A1 · Mar 10, 2016 · US
Polishing of hard substrates with soft-core composite particles
US-2016060488-A1 · Mar 3, 2016 · US
Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors
US-9263296-B2 · Feb 16, 2016 · US
Etching liquid, etching method, and method of manufacturing solder bump
US-2016042993-A1 · Feb 11, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09G1/04?
- CPC C09G1/04 is the Cooperative Patent Classification code for “Aqueous dispersions (C09G1/02 takes precedence).”
- How many patents are filed under CPC C09G1/04 (Aqueous dispersions (C09G1/02 takes precedence))?
- Our database includes 503 publications tagged with this CPC code.
- Is patent activity under CPC C09G1/04 growing?
- Publication counts under this code: 40 in 2024 vs 18 in 2025 (latest complete years).