Bonded body and power module substrate
US-9530717-B2 · Dec 27, 2016 · US
Aluminium
Aluminium · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/402 |
| Official title | Aluminium |
| Display label | Aluminium |
| Total patents | 291 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 33 |
| 2017 | 35 |
| 2018 | 28 |
| 2019 | 17 |
| 2020 | 33 |
| 2021 | 28 |
| 2022 | 28 |
| 2023 | 23 |
| 2024 | 15 |
| 2025 | 21 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for sintering workpieces to be sintered, and system for this purpose
US-2016368828-A1 · Dec 22, 2016 · US
Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof
US-2016355944-A1 · Dec 8, 2016 · US
Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof
US-2016348262-A1 · Dec 1, 2016 · US
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US-9504144-B2 · Nov 22, 2016 · US
Substrate structures and methods of manufacture
US-2016323997-A1 · Nov 3, 2016 · US
Substrate structures and methods of manufacture
US-2016324008-A1 · Nov 3, 2016 · US
3d infiltration method
US-2016303762-A1 · Oct 20, 2016 · US
Manufacturing method of radiator-integrated substrate and radiator-integrated substrate
US-9474146-B2 · Oct 18, 2016 · US
Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof
US-9453289-B2 · Sep 27, 2016 · US
Bonded body and power module substrate
US-2016276244-A1 · Sep 22, 2016 · US
Soldering method and method of manufacturing semiconductor device
US-9434028-B2 · Sep 6, 2016 · US
Bonded body and power module substrate
US-2016249452-A1 · Aug 25, 2016 · US
Method for joining dissimilar engine components
US-2016236992-A1 · Aug 18, 2016 · US
Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module
US-9414512-B2 · Aug 9, 2016 · US
Substrate structures and methods of manufacture
US-9408301-B2 · Aug 2, 2016 · US
Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part
US-2016219693-A1 · Jul 28, 2016 · US
Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device
US-9401340-B2 · Jul 26, 2016 · US
Wafer holder and method for manufacturing the same
US-2016196999-A1 · Jul 7, 2016 · US
Method of producing bonded body and method of producing power module substrate
US-2016181123-A1 · Jun 23, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/402?
- CPC C04B2237/402 is the Cooperative Patent Classification code for “Aluminium.”
- How many patents are filed under CPC C04B2237/402 (Aluminium)?
- Our database includes 291 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/402 growing?
- Publication counts under this code: 15 in 2024 vs 21 in 2025 (latest complete years).