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Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US9504144B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9504144-B2 |
| Application number | US-201314374092-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 1, 2013 |
| Priority date | Feb 1, 2012 |
| Publication date | Nov 22, 2016 |
| Grant date | Nov 22, 2016 |
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Abstract
Official abstract text for this publication.
This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11 ; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11 ; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the nitride layer and the copper plate.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of manufacturing a power module substrate including a copper plate that is formed of copper or a copper alloy and is laminated and bonded on a surface of a ceramic substrate, the method comprising: a copper member-bonding paste coating process of coating a copper member-bonding paste and forming an Ag-nitride-forming element layer, which contains Ag and a nitride-forming element, on at least one of a bonding surface of the ceramic substrate an…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- H05K1/0271Primary
Electricity · mapped topic
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- What does patent US9504144B2 cover?
- This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11 ; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11 ; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 μm or less that is formed between the…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0271. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).