Copper/ceramic bonded body and insulating circuit substrate
US-2024203819-A1 · Jun 20, 2024 · US
based on copper
based on copper · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/124 |
| Official title | based on copper |
| Display label | based on copper |
| Total patents | 233 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 30 |
| 2017 | 18 |
| 2018 | 19 |
| 2019 | 23 |
| 2020 | 20 |
| 2021 | 18 |
| 2022 | 22 |
| 2023 | 15 |
| 2024 | 29 |
| 2025 | 23 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing power module substrate
US-9833855-B2 · Dec 5, 2017 · US
Ceramic pressure measuring cell and method for its manufacture
US-9816887-B2 · Nov 14, 2017 · US
Substrate for power modules, substrate with heat sink for power modules, and power module
US-9807865-B2 · Oct 31, 2017 · US
Power semiconductor substrates with metal contact layer and method of manufacture thereof
US-9768036-B2 · Sep 19, 2017 · US
Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
US-9723707-B2 · Aug 1, 2017 · US
Ceramic circuit board and method for producing same
US-2017181272-A1 · Jun 22, 2017 · US
Method for joining dissimilar engine components
US-2017173729-A1 · Jun 22, 2017 · US
Metal-on-ceramic substrates
US-2017151755-A1 · Jun 1, 2017 · US
Bonded body and power module substrate
US-9648737-B2 · May 9, 2017 · US
Method for joining dissimilar engine components
US-9586868-B2 · Mar 7, 2017 · US
Bonded body, power module substrate, power module and method for producing bonded body
US-2017062305-A1 · Mar 2, 2017 · US
Process for producing bonded body and process for producing power module substrate
US-2017044072-A1 · Feb 16, 2017 · US
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US-2017034905-A1 · Feb 2, 2017 · US
Active metal braze joint with stress relieving layer
US-2017014930-A1 · Jan 19, 2017 · US
Bonded body and power module substrate
US-9530717-B2 · Dec 27, 2016 · US
Light converter assemblies with enhanced heat dissipation
US-2016369954-A1 · Dec 22, 2016 · US
Ceramic pressure measuring cell and method for its manufacture
US-2016370241-A1 · Dec 22, 2016 · US
Metallic compositions useful for brazing, and related processes and devices
US-2016354869-A1 · Dec 8, 2016 · US
Copper-ceramic bonded body and power module substrate
US-2016358791-A1 · Dec 8, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/124?
- CPC C04B2237/124 is the Cooperative Patent Classification code for “based on copper.”
- How many patents are filed under CPC C04B2237/124 (based on copper)?
- Our database includes 233 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/124 growing?
- Publication counts under this code: 29 in 2024 vs 23 in 2025 (latest complete years).