Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same
US-12285841-B2 · Apr 29, 2025 · US
characterised by the movement of the work or lapping tool
characterised by the movement of the work or lapping tool · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B37/07 |
| Official title | characterised by the movement of the work or lapping tool |
| Display label | characterised by the movement of the work or lapping tool |
| Total patents | 47 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 8 |
| 2019 | 2 |
| 2020 | 7 |
| 2021 | 5 |
| 2022 | 6 |
| 2023 | 7 |
| 2024 | 5 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same
US-12280466-B2 · Apr 22, 2025 · US
Surface height measurement method using dummy disk
US-12257666-B2 · Mar 25, 2025 · US
Method of manufacturing a supporting glass substrate
US-12119278-B2 · Oct 15, 2024 · US
Apparatus and method for manufacturing display device
US-12090601-B2 · Sep 17, 2024 · US
Control of carrier head sweep and platen shape
US-2024139906-A1 · May 2, 2024 · US
Planarization methods for packaging substrates
US-11931855-B2 · Mar 19, 2024 · US
Substrate processing apparatus and substrate processing method
US-11911872-B2 · Feb 27, 2024 · US
Surface height measurement method using dummy disk
US-2023415299-A1 · Dec 28, 2023 · US
Substrate processing apparatus and substrate processing method
US-11850697-B2 · Dec 26, 2023 · US
Supporting glass substrate, laminate, semiconductor package, electronic device, and method of manufacturing semiconductor package
US-2023352355-A1 · Nov 2, 2023 · US
Substrate processing apparatus, polishing head, and substrate processing method
US-11787006-B2 · Oct 17, 2023 · US
Method of manufacturing semiconductor package
US-11749574-B2 · Sep 5, 2023 · US
Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same
US-2023211457-A1 · Jul 6, 2023 · US
Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same
US-2023131040-A1 · Apr 27, 2023 · US
Adhesive film for polishing pad, laminated polishing pad including the same and method of polishing wafer
US-2022380644-A1 · Dec 1, 2022 · US
Offset head-spindle for chemical mechanical polishing
US-11389925-B2 · Jul 19, 2022 · US
Apparatus and method for manufacturing display device
US-2022219284-A1 · Jul 14, 2022 · US
Apparatus and method for manufacturing display device
US-11311979-B2 · Apr 26, 2022 · US
Method for polishing a semiconductior wafer
US-2022080549-A1 · Mar 17, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B37/07?
- CPC B24B37/07 is the Cooperative Patent Classification code for “characterised by the movement of the work or lapping tool.”
- How many patents are filed under CPC B24B37/07 (characterised by the movement of the work or lapping tool)?
- Our database includes 47 publications tagged with this CPC code.
- Is patent activity under CPC B24B37/07 growing?
- Publication counts under this code: 5 in 2024 vs 3 in 2025 (latest complete years).