Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same

Patent metadata

Field	Value
Publication number	US-12285841-B2
Application number	US-202217984537-A
Country	US
Kind code	B2
Filing date	Nov 10, 2022
Priority date	Jan 6, 2022
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

Disclosed are an automatic abrasion compensation system of a lower plate and a wafer lapping apparatus having the same. The automatic abrasion compensation system reduces wafer misloading and errors in wafer loading inspection occurring when the distance between the lower plate and a transfer robot is gradually increased due to abrasion of the lower plate during a lapping process. The automatic abrasion compensation system includes an ultrasonic sensor provided on the transfer robot, a jig located directly under the ultrasonic sensor and mounted on the lower plate, a controller configured to acquire measurement distance information by measuring a distance from the jig through the ultrasonic sensor, to compare the measurement distance information with set reference distance information and to generate an adjustment control signal, and a driver configured to automatically adjust a Z-axis position of the transfer robot depending on the adjustment control signal transmitted by the controller.

First claim

What is claimed is:

1. An automatic abrasion compensation system of a lower plate, configured to uniformly adjust a distance between the lower plate and a transfer robot configured to load and unload wafers on and from the lower plate, the automatic abrasion compensation system comprising:
an ultrasonic sensor and a vacuum pad provided on one side of the transfer robot;
a jig located directly under the ultrasonic sensor, and mounted on the lower plate;
a controller configured to acquire measurement distance information by measuring a distance from the jig through the ultrasonic sensor, to compare the measurement distance information with set reference distance information, and to generate an adjustment control signal;
a driver configured to automatically adjust a Z-axis position of the transfer robot depending on the adjustment control signal transmitted by the controller; and
a jig transfer unit configured to load and unload the jig on and from the lower plate and is connected to be controlled by the controller.

2. The automatic abrasion compensation system according to claim 1 , wherein the reference distance information is distance information between the ultrasonic sensor and the jig mounted on the lower plate, measured for the first time after replacement with the lower plate,
wherein the measurement distance information is greater than the reference distance information by a wear thickness of the lower plate, the Z-axis position of the transfer robot is adjusted to be moved downwards by the wear thickness of the lower plate,
wherein reference distance information is stored in the controller, the controller unit has a monitor configured to display respective situation information, and
the jig is unloaded and removed from the lower plate after acquiring the reference distance information and the measured distance information.

3. A wafer lapping apparatus having the automatic abrasion compensation system according to claim 1 .

Assignees

• Sk Siltron Co Ltd

Inventors

• Lee Jae Pyo
• Jeong Seong Cheol
• Jung In Joon

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title