Method for conditioning polishing pad
US-11389928-B2 · Jul 19, 2022 · US
US12257666B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12257666-B2 |
| Application number | US-202318466002-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 13, 2023 |
| Priority date | Jan 31, 2019 |
| Publication date | Mar 25, 2025 |
| Grant date | Mar 25, 2025 |
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A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.
Opening claim text (preview).
What is claimed is: 1. A method, performing by a data processing portion, comprising: making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface; calculating a tilt angle of the table profile with respect to a horizontal line that is a virtual line indicating a horizontal direction of the polishing table; correcting the table profile by that the data processing portion make the table profile rotate with respect to the horizontal line until the tilt angle is 0°; rotating the polishing pad arranged on the table surface along with the polishing table, and rotating the dressing disk; bringing the dressing disk into contact with a polishing surface of the polishing pad while the liquid is supplied to the polishing surface; measuring heights of the polishing surface at a plurality of measurement points while the dressing disk is moved on the polishing surface; and creating an initial pad profile showing a height distribution of the polishing surface from measurement values of the heights of the polishing surface, wherein the dummy disk is fixed to a disk holder of a dresser when the heights of the table surface of the polishing table are measured, the dummy disk comprises: a first surface capable of coming into contact with the disk holder; and a second surface which is on an opposite side of the first surface, wherein the second surface has a plurality of liquid discharge channels, and the plurality of liquid discharge channels extends from one end of the second surface to the other end, wherein the dressing disk is fixed to the disk holder of the dresser when the polishing surface of the polishing pad is dressed, and the dressing disk comprises: a first surface capable of coming into contact with the disk holder; and a second surface which is on an opposite side of the first surface of the dressing disk, wherein the second surface of the dressing disk has a plurality of protrusion portions and the plurality of liquid discharge channels positioned between the plurality of protrusion portions, the plurality of liquid discharge channels extends from one end of the second surface to the other end, and abrasive grains are fixed to surfaces of the plurality of protrusion portions. 2. The method according to claim 1 , further comprising: correcting the initial pad profile by that the data processing portion make the initial pad profile rotate with respect to the horizontal line by an angle the same as the tilt angle in which the table profile is rotated. 3. The method according to claim 2 , further comprising: displaying the corrected table profile and the corrected initial pad profile on a display screen. 4. A method, performing by a data processing portion, comprising: making a first polishing table and a dummy disk rotate; bringing the dummy disk into contact with a first table surface of the first polishing table while a liquid is supplied to the first table surface; measuring heights of the first table surface at a plurality of measurement points while the dummy disk is moved on the first table surface; creating a first table profile showing tilt of the first table surface from measurement values of the heights of the first table surface; calculating a tilt angle of the first table profile with respect to a horizontal line that is a virtual line indicating a horizontal direction of the polishing table; correcting the first table profile by rotating the first table profile until the tilt angle is 0; rotating a second polishing table and the dummy disk; bringing the dummy disk into contact with a second table surface of the second polishing table while the liquid is supplied to the second table surface; measuring heights of the second table surface at a plurality of measurement points while the dummy disk is moved on the second table surface; creating a second table profile showing tilt of the second table surface from measurement values of the heights of the second table surface; calculating a tilt angle of the second table profile with respect to the horizontal line; and correcting the second table profile by rotating the second table profile until the tilt angle of the second table profile is 0°, wherein the dummy disk is fixed to a disk holder of a dresser when heights of the first table surface of the polishing table are measured, the dummy disk comprises: a first surface capable of coming into contact with the disk holder; and a second surface which is on an opposite side of the first surface of the dummy disk, wherein the second surface dummy disk has a plurality of liquid discharge channels, and the plurality of liquid discharge channels extends from one end of the second surface to the other end.
Dressing tools; Holders therefor · CPC title
for single side lapping · CPC title
characterised by the movement of the work or lapping tool · CPC title
Control means for lapping machines or devices · CPC title
characterised by the shape of the lapping pad surface, e.g. grooved · CPC title
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