Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-11911872-B2
Application number	US-202117166521-A
Country	US
Kind code	B2
Filing date	Feb 3, 2021
Priority date	Feb 5, 2020
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100 , an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300 A and 300 B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a table for supporting a substrate;
a pad holder for holding a polishing pad for polishing the substrate supported by the table;
an elevating mechanism for elevating the pad holder with respect to the substrate;
a swing mechanism for swinging the pad holder in a radial direction of the substrate;
a supporting member for supporting the polishing pad swung to outside the table by the swing mechanism; and
a driving mechanism for adjusting at least one of a height and a distance to the substrate of the supporting member while polishing the substrate,
wherein the supporting member has a support surface for supporting a polishing surface of the polishing pad, the polishing surface being to be brought into contact with the substrate, the support surface of the supporting member having an implanted vacuum passage communicated with a vacuum member.

2. The substrate processing apparatus according to claim 1 , wherein
the supporting member includes a first supporting member arranged in a swing path of the polishing pad outside the table and a second supporting member arranged in a swing path of the polishing pad at an opposite side of the first supporting member across the table.

3. The substrate processing apparatus according to claim 2 , wherein
the first supporting member and the second supporting member each have a support surface configured to support a whole polishing surface of the polishing pad, the polishing surface being to be brought into contact with the substrate.

4. The substrate processing apparatus according to claim 1 , further comprising
a film thickness measuring instrument for measuring a film thickness profile of a surface to be polished of the substrate while polishing the substrate, wherein
the driving mechanism is configured to adjust at least one of the height and the distance to the substrate of the supporting member in accordance with the film thickness profile measured by the film thickness measuring instrument.

5. The substrate processing apparatus according to claim 4 , wherein
the driving mechanism is configured such that the driving mechanism lowers the height of the supporting member or widens the distance to the substrate of the supporting member when a film thickness on an edge portion of the substrate is thicker than a film thickness in a center portion in the film thickness profile measured by the film thickness measuring instrument.

6. The substrate processing apparatus according to claim 1 , further comprising
a substrate thickness measuring instrument for measuring a thickness of the substrate installed on the table, wherein
the driving mechanism is configured to adjust the height of the supporting member based on the thickness of the substrate measured by the substrate thickness measuring instrument.

7. The substrate processing apparatus according to claim 1 , further comprising
a diameter measuring instrument for measuring a diameter of the substrate installed on the table, wherein
the driving mechanism is configured to adjust the distance to the substrate of the supporting member based on the diameter of the substrate measured by the diameter measuring instrument.

8. The substrate processing apparatus according to claim 1 , wherein
the supporting member includes a plurality of supporting members divided by a virtual division line, the virtual division line running along the radial direction of the substrate, and
the driving mechanism is configured to adjust at least one of the height and the distance to the substrate of the supporting member while polishing the substrate independently, for each of the plurality of supporting members.

9. The substrate processing apparatus according to claim 1 , wherein
the support surface of the supporting member has an implanted dresser for toothing the polishing pad.

10. A substrate processing apparatus comprising:
a table for supporting a substrate;
a pad holder for holding a polishing pad for polishing the substrate supported by the table;
an elevating mechanism for elevating the pad holder with respect to the substrate;
a swing mechanism for swinging the pad holder in a radial direction of the substrate;
a supporting member for supporting the polishing pad swung to outside the table by the swing mechanism; and
a driving mechanism for adjusting at least one of a height and a distance to the substrate of the supporting member while polishing the substrate,
wherein the swing mechanism includes a first arm for holding the pad holder, a second arm for holding a cleaning tool holder for holding a cleaning tool, a third arm for holding a pad holder for holding a polishing pad with a diameter different from a diameter of the polishing pad, a fourth arm for holding a photographing member, a swing shaft that supports the first, second, third, and fourth arms, and a rotation drive mechanism for rotatably driving the swing shaft, and
each of the first, second, third, and fourth arms is radially arranged in a peripheral area of the swing shaft.

11. The substrate processing apparatus according to claim 10 , wherein
the second arm is configured to further hold atomizers together with the cleaning tool, the atomizers being arranged at both sides of the cleaning tool.

Assignees

• Ebara Corp

Inventors

• Takada Nobuyuki
• Yasuda Hozumi

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• B24B9/065 Primary

  of thin, brittle parts, e.g. semiconductors, wafers · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B37/30

  for single side lapping of plane surfaces · CPC title