Substrate polishing apparatus, substrate polishing system including the same, and substrate polishing method using the same

Patent metadata

Field	Value
Publication number	US-12280466-B2
Application number	US-202217825449-A
Country	US
Kind code	B2
Filing date	May 26, 2022
Priority date	Oct 22, 2021
Publication date	Apr 22, 2025
Grant date	Apr 22, 2025

Abstract

Disclosed are substrate polishing apparatuses, substrate polishing systems, and/or substrate polishing methods. The substrate polishing apparatus may include an electric field applying module, and a platen that rotates a polishing pad. The electric field applying module may include an inner electrode having a circular shape when viewed in plan. The platen may be on the inner electrode. A central axis of the inner electrode may be spaced apart from a central axis of the platen. The inner electrode may include a first electrode and a second electrode that may surround the first electrode and may have an annular shape.

First claim

What is claimed is:

1. A substrate polishing apparatus, comprising:
an electric field applying module; and
a platen configured to rotate a polishing pad,
wherein the electric field applying module includes an inner electrode having a circular shape when viewed in plan,
wherein the platen is on the inner electrode,
wherein a central axis of the inner electrode is spaced apart from a central axis of the platen,
wherein the inner electrode includes a first electrode and a second electrode, and
wherein the second electrode surrounds the first electrode and has an annular shape.

2. The substrate polishing apparatus of claim 1 , wherein a diameter of the inner electrode is in a range of about 250 mm to about 350 mm.

3. The substrate polishing apparatus of claim 1 , wherein the inner electrode further includes a first dielectric layer between the first electrode and the second electrode.

4. The substrate polishing apparatus of claim 1 , wherein the inner electrode further includes a third electrode that surrounds the second electrode and has an annular shape.

5. The substrate polishing apparatus of claim 1 ,
wherein the electric field applying module further includes an outer electrode that surrounds the inner electrode, and
wherein the outer electrode has a circular shape when viewed in plan.

6. The substrate polishing apparatus of claim 5 , wherein
a central axis of the outer electrode is coincident with the central axis of the platen, and
a diameter of the outer electrode is in a range of about 700 mm to about 900 mm.

7. The substrate polishing apparatus of claim 1 ,
wherein the electric field applying module further includes a voltage applying device that is configured to apply a voltage to the inner electrode,
wherein the voltage applying device includes a first voltage applier configured to apply a first voltage to the first electrode and a second voltage applier configured to apply a second voltage to the second electrode.

8. The substrate polishing apparatus of claim 1 , wherein the platen includes:
a platen body that provides an internal space;
a plurality of upper electrodes coupled to an upper portion of the platen body;
a plurality of lower electrodes coupled to a lower portion of the platen body and exposed toward a lower portion of the platen; and
a plurality of connection members in the internal space and connecting corresponding lower electrodes to corresponding upper electrodes among the plurality of lower electrodes and the plurality of upper electrodes.

9. The substrate polishing apparatus of claim 8 , further comprising:
a plurality of connection electrodes between the plurality of lower electrodes and the inner electrode,
wherein the plurality of connection electrodes include a conductive textile material.

10. The substrate polishing apparatus of claim 1 , wherein
the first electrode includes a plurality of first split electrodes,
the second electrode includes a plurality of second split electrodes, and
the plurality of second split electrodes are arranged in a circumferential direction.

11. A substrate polishing system, comprising:
a platen;
a polishing pad on the platen;
a slurry supply apparatus configured to supply slurry to a top surface of the polishing pad;
a polishing head that supports a substrate; and
a platen electrode coupled to the platen,
wherein the platen electrode includes a first electrode and a second electrode,
wherein the second electrode surrounds the first electrode and has an annular shape, and
wherein each of the first electrode and the second electrode is divided into a plurality of electrodes that are split along a circumferential direction of the platen,
wherein a central axis of at least one of the first electrode and the second electrode is spaced apart from a central axis of the platen.

12. The substrate polishing system of claim 11 , wherein
the substrate supported is in contact with the polishing pad on a polishing location in the polishing pad, and
when viewed in plan, a region where the second electrode overlaps the polishing location has a maximum thickness in a radial direction of about 1 mm to about 8 mm.

13. The substrate polishing system of claim 11 , wherein
the substrate is in contact with the polishing pad on a polishing location in the polishing pad, and
when viewed in plan, a region where the first electrode overlaps the polishing location has a maximum thickness in a radial direction of about 1 mm to about 8 mm.

14. The substrate polishing system of claim 11 , wherein the platen electrode is on the platen and in contact with the polishing pad.

15. The substrate polishing system of claim 11 , further comprising:
an electric field applying apparatus including a voltage applying device that is configured to apply a voltage to the platen electrode,
wherein the voltage applying device includes a first voltage applier configured to apply a first voltage to the first electrode and a second voltage applier configured to apply a second voltage to the second electrode.

16. A substrate polishing method, comprising:
using a polishing head to place a substrate on a platen;
causing the substrate to contact a polishing pad, the polishing pad being configured to rotate;
supplying slurry onto the polishing pad; and
generating an electric field on the polishing pad,
wherein generating the electric field on the polishing pad includes generating an electric field on a polishing location with which the substrate is in contact, the polishing location being a portion of a top surface of the polishing pad,
wherein the polishing location includes a first polishing area and a second polishing area that surrounds the first polishing area, and
wherein the generating the electric field on the polishing location includes applying a first voltage to a first electrode and a second voltage to a second electrode,
the first electrode is beneath the first polishing area,
the second electrode is beneath the second polishing area, and
the second voltage is different from the first voltage,
wherein a central axis of at least one of the first electrode or the second electrode is spaced apart from a central axis of the platen.

17. The substrate polishing method of claim 16 ,
wherein the generating the electric field on the polishing pad further includes generating an electric field on a remaining area of a top surface of the polishing pad, and
the remaining area of the polishing pad is a portion of the top surface of the polishing pad other than the polishing location.

18. The substrate polishing method of claim 16 , wherein each of the first electrode and the second electrode is beneath the platen.

19. The substrate polishing method of claim 18 , wherein the causing the substrate to contact the polishing pad includes:
causing the substrate to perform a translational motion on the polishing pad; and
causing each of the first electrode and the second electrode to perform translational motions, respectively.

20. The substrate polishing method of claim 16 , wherein
each of the first electrode and the second electrode are coupled to the platen and configured to rotate together with the polishing pad,
the first electrode is divided into a plurality of first split electrodes along a circumferential direction of the platen,
the second electrode is divided into a plurality of second split electrodes along the circumferential direction of the platen,
the applying the first voltage to the first electrode includes

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jaehyug
• Kim Chae Lyoung
• Kim Hoyoung
• Lee Seungjun

Classifications

• B24B37/07 Primary

  characterised by the movement of the work or lapping tool · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/10

  for single side lapping · CPC title

• B24B37/26

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title