Automatic abrasion compensation system of lower plate and wafer lapping apparatus having the same

Patent metadata

Field	Value
Publication number	US-2023211457-A1
Application number	US-202217984537-A
Country	US
Kind code	A1
Filing date	Nov 10, 2022
Priority date	Jan 6, 2022
Publication date	Jul 6, 2023
Grant date	—

Abstract

Disclosed are an automatic abrasion compensation system of a lower plate and a wafer lapping apparatus having the same. The automatic abrasion compensation system reduces wafer misloading and errors in wafer loading inspection occurring when the distance between the lower plate and a transfer robot is gradually increased due to abrasion of the lower plate during a lapping process. The automatic abrasion compensation system includes an ultrasonic sensor provided on the transfer robot, a jig located directly under the ultrasonic sensor and mounted on the lower plate, a controller configured to acquire measurement distance information by measuring a distance from the jig through the ultrasonic sensor, to compare the measurement distance information with set reference distance information and to generate an adjustment control signal, and a driver configured to automatically adjust a Z-axis position of the transfer robot depending on the adjustment control signal transmitted by the controller.

First claim

What is claimed is:

1 . An automatic abrasion compensation system of a lower plate, configured to uniformly adjust a distance between the lower plate and a transfer robot configured to load and unload wafers on and from the lower plate, the automatic abrasion compensation system comprising:
an ultrasonic sensor provided on the transfer robot; a jig located directly under the ultrasonic sensor, and mounted on the lower plate; a controller configured to acquire measurement distance information by measuring a distance from the jig through the ultrasonic sensor, to compare the measurement distance information with set reference distance information, and to generate an adjustment control signal; and a driver configured to automatically adjust a Z-axis position of the transfer robot depending on the adjustment control signal transmitted by the controller.

2 . The automatic abrasion compensation system according to claim 1 , further comprising a jig transfer unit configured to load and unload the jig on and from the lower plate.

3 . The automatic abrasion compensation system according to claim 1 , wherein the reference distance information is distance information between the ultrasonic sensor and the jig mounted on the lower plate, initially measured after replacement with the lower plate.

4 . The automatic abrasion compensation system according to claim 1 , wherein the measurement distance information comprises the reference distance information and a wear thickness of the lower plate, and the Z-axis position of the transfer robot is adjusted to be moved downwards by the wear thickness of the lower plate.

5 . The automatic abrasion compensation system according to claim 1 , wherein the jig is mounted in a hole formed in a carrier coupled to the lower plate.

6 . A wafer lapping apparatus having the automatic abrasion compensation system according to claim 1 .

Assignees

• Sk Siltron Co Ltd

Inventors

• Lee Jae Pyo
• Jeong Seong Cheol
• Jung In Joon

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• B24B37/30

  for single side lapping of plane surfaces · CPC title