Chip resistor

Patent metadata

Field	Value
Publication number	US-9627110-B2
Application number	US-201214369599-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Dec 28, 2011
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

[Problem] There is demand for chip resistors that are compact and that have high resistivity. [Solution] A chip resistor ( 100 ) has a substrate ( 11 ), a first connection electrode ( 12 ) and a second connection electrode ( 13 ) that are formed on the substrate ( 11 ), and a resistor network that is formed on the substrate ( 11 ) and that has ends one of which is connected to the first connection electrode ( 12 ) and the other one of which is connected to the second connection electrode ( 13 ). The resistor network is provided with a resistive circuit. The resistive circuit has a resistive element film line ( 103 ) that is provided along inner wall surfaces of trenches ( 101 ). The resistive element film line ( 103 ) extending along the inner wall surfaces of the trenches ( 101 ) is long and has a high resistivity as a unit resistive element. [Effect] The resistivity of the chip resistor ( 100 ) as a whole can be increased.

First claim

The invention claimed is:

1. A chip resistor comprising:
a substrate having a circuit forming surface;
a first connection electrode and a second connection electrode that are formed on the substrate; and
a resistor network that is formed on the substrate and that has ends one of which is connected to the first connection electrode and an opposite one of which is connected to the second connection electrode;
wherein a trench is dug down to a predetermined depth from the circuit forming surface of the substrate and is formed at the circuit forming surface, and
wherein the resistor network includes a resistive circuit that has a resistive element film disposed along an inner wall surface of the trench in such a manner as to traverse the trench, and
wherein the substrate is free of doped impurities that form a transistor.

2. The chip resistor according to claim 1 , wherein the resistor network includes a plurality of resistive circuits, and further includes a fuse film
that is fusible at a position to electrically connect an arbitrary resistive circuit and the resistor network so that the arbitrary resistive circuit is electrically connected to the resistor network, or
that is fusible at a position to be electrically disconnected from the resistor network while being connected to the arbitrary resistive circuit such that the arbitrary resistive circuit is separated from the resistor network.

3. The chip resistor according to claim 2 , wherein the resistive element film includes a line-shaped resistive element film line that has a constant width and that extends linearly.

4. The chip resistor according to claim 3 , wherein the trench extends in a predetermined direction when the circuit forming surface is viewed planarly, and the resistive element film includes a plurality of resistive element film lines arrayed in parallel, that are disposed along the inner wall surface of the trench in such a manner so as to traverse the trench and that extend in a direction perpendicular to a length direction in which the trench extends.

5. The chip resistor according to claim 3 , wherein the resistive element film extends from the inner wall surface of the trench to the circuit forming surface outside the trench and the chip resistor further comprises a wiring film that is formed contiguously with a part of the resistive element film formed at the circuit forming surface.

6. The chip resistor according to claim 2 , wherein the resistive element film extends from the inner wall surface of the trench to the circuit forming surface outside the trench and the chip resistor further comprises a wiring film that is formed contiguously with a part of the resistive element film formed at the circuit forming surface.

7. The chip resistor according to claim 2 , wherein the resistive element film is made of TiN, TiON or TiSiON.

8. The chip resistor according to claim 1 , wherein the resistive element film includes a line-shaped resistive element film line that has a constant width and that extends linearly.

9. The chip resistor according to claim 8 , wherein the trench extends in a predetermined direction when the circuit forming surface is viewed planarly, and the resistive element film includes a plurality of resistive element film lines arrayed in parallel, that are disposed along the inner wall surface of the trench in such a manner so as to traverse the trench and that extend in a direction perpendicular to a length direction in which the trench extends.

10. The chip resistor according to claim 9 , wherein the resistive element film is made of TiN, TiON or TiSiON.

11. The chip resistor according to claim 8 , wherein the resistive element film extends from the inner wall surface of the trench to the circuit forming surface outside the trench and the chip resistor further comprises a wiring film that is formed contiguously with a part of the resistive element film formed at the circuit forming surface.

12. The chip resistor according to claim 8 , wherein the resistive element film is made of TiN, TiON or TiSiON.

13. The chip resistor according to claim 1 , wherein the resistive element film extends from the inner wall surface of the trench to the circuit forming surface outside the trench and the chip resistor further comprises a wiring film that is formed contiguously with a part of the resistive element film formed at the circuit forming surface.

14. The chip resistor according to claim 13 , wherein the resistive element film is made of TiN, TiON or TiSiON.

15. The chip resistor according to claim 1 , wherein the resistive element film is made of TiN, TiON or TiSiON.

16. The chip resistor according to claim 1 , wherein the resistive element film is line-shaped and made of TiN, TION or TiSiON.

Assignees

• Tamagawa Hiroshi
• Kondo Yasuhiro
• Rohm Co Ltd

Inventors

• Tamagawa Hiroshi
• Kondo Yasuhiro

Classifications

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H01C1/012

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C17/006 Primary

  adapted for manufacturing resistor chips · CPC title

• H05K2201/10212

  Programmable component · CPC title