Chip resistor and method for making the same

Patent metadata

Field	Value
Publication number	US-9514867-B2
Application number	US-201414189395-A
Country	US
Kind code	B2
Filing date	Feb 25, 2014
Priority date	Feb 26, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.

First claim

The invention claimed is:

1. A chip resistor comprising:
an insulating substrate including a substrate obverse surface, a substrate reverse surface and a first substrate side surface, the substrate obverse surface and the substrate reverse surface being spaced apart from each other in a thickness direction of the substrate, the first substrate side surface being configured to face in a first direction perpendicular to the thickness direction;
a resistor element arranged on the substrate obverse surface;
a bonding layer provided between the resistor element and the substrate obverse surface;
a first electrode connected to the resistor element; and
a second electrode connected to the resistor element, the second electrode being deviated from the first electrode in a second direction opposite from the first direction;
wherein the first electrode includes a base layer and a connecting layer, the base layer being formed on the substrate reverse surface, the connecting layer electrically connecting the base layer to the resistor element, and
the resistor element includes a resistor element obverse surface facing in a same direction as the substrate obverse surface, and the resistor element obverse surface is directly covered by the connecting layer.

2. The chip resistor according to claim 1 , wherein the connecting layer directly covers the base layer, the first substrate side surface and the resistor element.

3. The chip resistor according to claim 1 , wherein the base layer is provided between the connecting layer and the substrate reverse surface.

4. The chip resistor according to claim 1 , wherein the connecting layer is 0.5-1.0 nm in thickness.

5. The chip resistor according to claim 1 , wherein the connecting layer is formed by PVD or CVD.

6. The chip resistor according to claim 5 , wherein the PVD comprises sputtering.

7. The chip resistor according to claim 1 , wherein the resistor element is serpentine as viewed in the thickness direction of the substrate.

8. The chip resistor according to claim 1 , wherein the resistor element includes a resistor element side surface facing in the first direction, the resistor element side surface being directly covered by the connecting layer.

9. The chip resistor according to claim 1 , wherein the first electrode includes a plating layer covering the connecting layer.

10. The chip resistor according to claim 9 , wherein the plating layer includes a Cu layer covering the connecting layer, an Ni layer covering the Cu layer and an Sn layer covering the Ni layer.

11. The chip resistor according to claim 1 , wherein the substrate includes a second substrate side surface facing in the second direction, and the second electrode covers the resistor element, the second substrate side surface and the substrate reverse surface.

12. The chip resistor according to claim 11 , wherein the substrate includes a third substrate side surface and a fourth substrate side surface facing away from each other, the third substrate side surface facing in a third direction perpendicular to the thickness direction of the substrate and the first direction, both of the third substrate side surface and the fourth substrate side surface being exposed.

13. The chip resistor according to claim 1 , further comprising an insulating protective film covering the resistor element, wherein the protective film is held in direct contact with the first electrode and the second electrode.

14. The chip resistor according to claim 1 , wherein the base layer is made of Ag.

15. The chip resistor according to claim 1 , wherein the substrate is made of a ceramic material or a resin.

16. The chip resistor according to claim 1 , wherein the bonding layer is made of an epoxy-based material.

17. The chip resistor according to claim 1 , wherein the resistor element is made of Ni—Cr alloy, Cu—Ni alloy or Fe—Cr alloy.

18. A method for making a chip resistor as set forth in claim 1 , the method comprising the steps of:
preparing an insulating substrate sheet; and
bonding a resistor element material on an obverse surface of the insulating substrate sheet by using a bonding material.

19. The method according to claim 18 , further comprising the step of forming an electrically conductive base layer on a reverse surface of the substrate sheet.

20. The method according to claim 19 , wherein the step of forming the base layer is performed by printing.

21. The method according to claim 19 , wherein the base layer is made of Ag.

22. The method according to claim 18 , wherein the bonding material comprises an adhesive sheet or a liquid adhesive.

23. The method according to claim 18 , further comprising the step of forming an insulating protective film for covering the resistor element material.

24. The method according to claim 18 , further comprising the step of dividing the substrate sheet into a plurality of bars.

25. The method according to claim 24 , wherein each of the bars includes an elongated bar side surface and
the method further comprises the step of applying an electrically conductive material to the bar side surface of each bar.

26. The method according to claim 25 , wherein the step of applying an electrically conductive material is performed by PVD or CVD.

27. The method according to claim 26 , wherein the PVD comprises sputtering.

28. The method according to claim 25 , wherein the electrically conductive material is collectively to the bar side surfaces of the plurality of bars.

29. The method according to claim 24 , wherein a plurality of grooves are formed in the obverse surface and the reverse surface of the substrate sheet, and
the step of dividing into a plurality of bars comprises dividing the substrate sheet along the grooves.

30. The method according to claim 29 , further comprising the step of dividing the bars along a width direction of the bars to obtain individual pieces.

31. The method according to claim 30 , further comprising the step of forming a plating layer on each of the individual pieces.

32. A chip resistor comprising:
an insulating substrate including a substrate obverse surface, a substrate reverse surface and a first substrate side surface, the substrate obverse surface and the substrate reverse surface being spaced apart from each other in a thickness direction of the substrate, the first substrate side surface being configured to face in a first direction perpendicular to the thickness direction;
a resistor element arranged on the substrate obverse surface;
a bonding layer provided between the resistor element and the substrate obverse surface;
a first electrode connected to the resistor element; and
a second electrode connected to the resistor element, the second electrode being deviated from the first electrode in a second direction opposite from the first direction,
wherein the bonding layer includes a bonding layer obverse surface facing in a same direction as the substrate obverse surface, and the bonding layer obverse surface is held in direct contact with the resistor element,
the first electrode includes a base layer and a connecting layer, the base layer being formed on the substrate reverse surface, the connecting layer electrically connecting the base layer to the resistor element, and
the resistor element has a resistor element

Assignees

• Rohm Co Ltd

Inventors

• Harada Kenichi
• Yoneda Masaki

Classifications

• Y10T29/49099

  Coating resistive material on a base · CPC title

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• H01C1/08

  Cooling, heating or ventilating arrangements · CPC title

• H01C17/006 Primary

  adapted for manufacturing resistor chips · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title