Resistor element and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016172084-A1
Application number	US-201514953940-A
Country	US
Kind code	A1
Filing date	Nov 30, 2015
Priority date	Dec 15, 2014
Publication date	Jun 16, 2016
Grant date	—

Abstract

A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

First claim

What is claimed is:

1 . A resistor element comprising:
a base substrate; a resistor layer on one surface of the base substrate; a first electrode layer and a second electrode layer on the resistor layer, spaced apart from each other; a third electrode layer between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, and thicker than each of the first electrode layer and the second electrode layer; and first to third plating layers on the first to third electrode layers, respectively.

2 . The resistor element of claim 1 , wherein the third electrode layer includes two or more layers.

3 . The resistor element of claim 1 , wherein each of the first and second plating layers is thicker than the third plating layer.

4 . The resistor element of claim 1 , wherein the resistor layer includes:
a first resistor part connected to a first terminal including the first electrode layer and a second terminal including the second electrode layer to form resistance; and a second resistor part connected to the second terminal and a third terminal including the third electrode layer to form resistance, and the first resistor part is integrally formed with the second resistor part.

5 . The resistor element of claim 1 , wherein the first to third plating layers are formed using barrel plating.

6 . The resistor element of claim. 1 , wherein the resistor layer includes:
a first resistor part connected to a first terminal including the first electrode layer and a second terminal including the second electrode layer to form resistance; and a second resistor part connected to the second terminal and a third terminal including the third electrode layer to form resistance, and either one of the first resistor part and the second resistor part is trimmed according to a resistance value thereof to determine a resistance value of the remaining resistor part.

7 . The resistor element of claim 1 , further comprising a protective layer disposed on portions of a surface of the resistor layer exposed among the first to third electrode layers.

8 . The resistor element of claim 1 , further comprising first and second back surface electrodes and selectively disposed on the other surface of the base substrate to face the first and second electrode layers.

9 . The resistor element of claim 8 , further comprising first and second side surface electrodes connecting the first and second electrode layers and the first and second back surface electrodes to each other, respectively.

10 . The resistor element of claim 9 , wherein the first and second plating layers cover the first and second electrode layers, the first and second side surface electrodes, and the first and second back surface electrodes, respectively.

11 . A method of manufacturing a resistor element comprising:
preparing a base substrate; forming a resistor layer on one surface of the base substrate; forming a first electrode layer and a second electrode layer, and a third electrode layer which is thicker than each of the first electrode layer and the second electrode layer; and forming first to third plating layers on the first to third electrode layers, respectively.

12 . The method of claim 11 , wherein the third electrode layer includes two or more layers.

13 . The method of claim 11 , wherein each of the first and second plating layers is thicker than the third plating layer.

14 . The method of claim 11 , wherein the first to third plating layers are formed using a barrel plating method.

15 . The method of claim 11 , further comprising forming a protective layer on portions of a surface of the resistor layer exposed among the first to third electrode layers, prior to forming the first to third plating layers.

Assignees

• Samsung Electro Mech

Inventors

• Nam Jung Min
• Lee Jea Hoon
• Kim Young Key
• Kim Hae In

Classifications

• H01C17/281

  by thick film techniques · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H01C1/01

  Mounting; Supporting · CPC title

• H01C1/142 Primary

  the terminals or tapping points being coated on the resistive element · CPC title

• H01C1/012

  the base extending along and imparting rigidity or reinforcement to the resistive element (H01C1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C3/18, H01C3/20; the resistive element being formed as one or more layers or coatings on a base H01C7/00) · CPC title