Chip component and method of producing the same

Patent metadata

Field	Value
Publication number	US-9484135-B2
Application number	US-201314376417-A
Country	US
Kind code	B2
Filing date	Jan 8, 2013
Priority date	Feb 3, 2012
Publication date	Nov 1, 2016
Grant date	Nov 1, 2016

Abstract

[Subject] To provide a highly-reliable and small-size chip component, e.g., a chip resistor having an accurate resistance value.
[Solution] The chip resistor ( 10 ) includes: a substrate ( 11 ); a plurality of resistor elements each having a resistive film portion ( 20 ) provided on the substrate ( 11 ) and an aluminum-containing interconnection film portion ( 21 ) provided in contact with the resistive film portion ( 20 ); electrodes ( 12, 13 ) provided on the substrate ( 11 ); and a plurality of fuses (F) each having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portion of the resistor element and disconnectably connecting the resistor element to the electrodes ( 12, 13 ).
[Effect] The resistance of the chip resistor can be adjusted at a desired resistance value by selectively disconnecting desired ones of the fuses. Since the fuses are formed in a minute layout pattern from an aluminum-containing interconnection film, the processing accuracy is improved in the disconnecting step.

First claim

The invention claimed is:

1. A chip component comprising:
a substrate;
a plurality of functional elements each having a resistor element having a resistive film portion provided on the substrate and an aluminum-containing interconnection film portion provided on the substrate and in contact with the resistive film portion;
an electrode provided on the substrate; and
a plurality of fuses each having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portion of at least one of the functional elements and disconnectably connecting the at least one functional element to the electrode; and
an electrode pad having an aluminum-containing interconnection film portion integral with the aluminum-containing interconnection film portions of the fuses, wherein
the electrode contacts the electrode pad, and
the chip component is a chip resistor.

2. The chip component according to claim 1 ,
wherein at least one of the fuses is disconnected,
the chip component further comprising an insulative protective film provided on the substrate as covering a disconnected portion of the disconnected fuse.

3. A chip resistor production method comprising the steps of:
forming a resistive film on a substrate having a plurality of chip resistor regions;
forming an aluminum-containing interconnection film in contact with the resistive film;
patterning the resistive film and the aluminum-containing interconnection film to form a plurality of resistor elements each including a resistive film portion and an aluminum-containing interconnection film portion and a plurality of fuses each having an aluminum-containing interconnection film portion and disconnectably connected to the resistor elements in each of the chip resistor regions;
simultaneously measuring overall resistance values in the respective chip resistor regions by a multi-probing method;
selecting a to-be-disconnected fuse in each of the chip resistor regions based on the results of the measurement of the overall resistance values;
disconnecting the selected fuse;
forming an electrode in each of the chip resistor regions so as to electrically connect the electrode to the fuses; and
cutting the substrate along a boundary region defined between the chip resistor regions to divide the substrate into a plurality of chip resistors.

4. The chip resistor production method of claim 3 , further comprising the step of simultaneously measuring overall resistance values in the respective chip resistor regions by a multi-probing method after the fuse disconnecting step.

5. The chip resistor production method according to claim 3 ,
wherein an electrode pad is formed from the aluminum-containing interconnection film in the step of patterning the resistive film and the aluminum-containing interconnection film, and the electrode is formed in contact with the electrode pad.

6. The chip resistor production method according to claim 3 , further comprising the step of performing a heat treatment for stabilizing characteristic properties of the resistor elements before the measurement of the overall resistance values in the respective chip resistor regions.

7. The chip resistor production method according to claim 3 further comprising the step of forming an insulative film on the substrate to cover a disconnected portion of the disconnected fuse.

Assignees

• Rohm Co Ltd

Inventors

• Kondo Yasuhiro
• Tamagawa Hiroshi
• Yamamoto Hiroki

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W20/493

  Fuses, i.e. interconnections changeable from conductive to non-conductive · CPC title

• H10D89/10

  Integrated device layouts · CPC title

• H10D84/221 Primary

  of only diodes · CPC title

• H10D1/47

  Resistors having no potential barriers · CPC title