Chip resistor and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9343208-B2
Application number	US-201514616307-A
Country	US
Kind code	B2
Filing date	Feb 6, 2015
Priority date	Jan 6, 2012
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

First claim

What is claimed is:

1. A method of manufacturing a chip resistor, comprising:
forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and
dividing the resistor assembly into chip resistors, each of the chip resistors including:
a chip-shaped resistance body formed by a part of the resistance body member;
a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction; and
a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

2. The method of claim 1 , wherein the punching is performed by using a punching mold having a shape corresponding to a shape of the chip resistor.

3. The method of claim 2 , wherein a recess having a shape corresponding to a shape of the concave portions is formed in the punching mold.

4. The method of claim 2 , wherein the resistor assembly is punched by the punching mold in a direction perpendicular to both the first and second directions.

5. The method of claim 2 , wherein the punching mold has rounded corner portions.

6. The method of claim 1 , wherein the resistance body member has at least one elongated resistance body plate extended in the second direction,
wherein the conductive member has a plurality of elongated conductive plates, each being extended in the second direction, and
wherein the forming a resistor assembly comprises:
arranging the plurality of elongated conductive plates to be separated from each other in the first direction perpendicular to the second direction in which the elongated conductive plates are extended;
arranging the elongated resistance body plate in a position sandwiched between adjacent two elongated conductive plates among the plurality of elongated conductive plates; and
bonding the elongated resistance body plate and the adjacent elongated conductive plates.

7. The method of claim 6 , wherein the elongated resistance body plate and the adjacent elongated conductive plates are bonded to each other by welding.

8. The method of claim 7 , wherein the welding is a high energy beam welding including an electron beam welding and a laser beam welding.

9. The method of claim 6 , wherein a thickness of the elongated resistance body plate is smaller than that of the elongated conductive plate.

10. The method of claim 6 , wherein a cross-section of each of the elongated conductive plates has a rectangular shape.

11. The method of claim 6 , wherein a cross-section of the elongated resistance body plate has a rectangular shape.

12. The method of claim 1 , wherein the resistance body member is plate-shaped, and
wherein the forming a resistor assembly includes:
forming an insulating layer extended in the second direction on one surface of the resistance body member; and
forming the conductive member in a region where the insulating layer is not formed on the one surface by performing plating.

13. The method of claim 12 , wherein the plating includes a Cu plating.

14. The method of claim 1 , wherein the forming a resistor assembly comprises:
preparing a bonded body in which a plate-shaped resistance material and a plate-shaped conductive material are bonded to each other; and
removing a part of the conductive material to form the conductive member including the portions separated from each other in the first direction.

15. The method of claim 14 , wherein a cross-section of the conductive member has a rectangular shape.

16. The method of claim 1 , wherein, in the dividing the resistor assembly into chip resistors, the resistor assembly is collectively divided into the plurality of chip resistors.

Assignees

• Rohm Co Ltd

Inventors

• Tsukada Torayuki
• Naka Kentaro

Classifications

• Y10T156/1075

  of plural laminae from single stock and assembling to each other or to additional lamina · CPC title

• Y10T29/49082

  Resistor making · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• G01R3/00

  Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title