Semiconductor manufacturing apparatus

Patent metadata

Field	Value
Publication number	US-2016362793-A1
Application number	US-201514847374-A
Country	US
Kind code	A1
Filing date	Sep 8, 2015
Priority date	Jun 10, 2015
Publication date	Dec 15, 2016
Grant date	—

Abstract

A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.

First claim

1 . A semiconductor manufacturing apparatus comprising:
a container containing a mixed solution that includes a processing solution for plating processing of a substrate and an additive, the container being capable of draining a part of the mixed solution when a first condition is satisfied; a first supplier supplying the processing solution to the container; and a second supplier supplying the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.

2 . The apparatus of claim 1 , wherein the first condition is a fact that a concentration of the additive in the mixed solution has fallen below a predetermined value.

3 . The apparatus of claim 2 , further comprising a computing part calculating a calculation value of a concentration of the additive based on a drainage amount of the mixed solution, a supply amount of the processing solution from the first supplier, and a supply amount of the additive from the second supplier, wherein
a concentration of the additive to be used for the first condition is a calculation value of a concentration of the additive calculated by the computing part.

4 . The apparatus of claim 1 , wherein the first supplier supplies the processing solution periodically.

5 . The apparatus of claim 2 , wherein the first supplier supplies the processing solution periodically.

6 . The apparatus of claim 1 , further comprising a measuring part measuring a concentration of the additive in the container, wherein
the first condition is a fact that a measurement value of a concentration of the additive measured by the measurement part has fallen below a predetermined value.

7 . The apparatus of claim 2 , further comprising a measuring part measuring a concentration of the additive in the container, wherein
the first condition is a fact that a measurement value of a concentration of the additive measured by the measurement part has fallen below a predetermined value.

8 . The apparatus of claim 3 , further comprising a measuring part measuring a concentration value of the additive in the container, wherein
the first condition is a fact that a measurement value of a concentration of the additive measured by the measuring part has fallen below a predetermined value.

9 . The apparatus of claim 1 , wherein the first condition is a fact that a predetermined period has passed from drainage of a part of the mixed solution or supply of the additive.

10 . The apparatus of claim 1 , wherein
the container drains a part of the mixed solution in the container each time the first condition is satisfied plural times, and the second supplier supplies the additive to the container each time the first condition is satisfied, and the second supplier supplies the additive to the container when drainage of a part of the mixed solution is finished in a case where the container drains a part of the mixed solution.

11 . The apparatus of claim 2 , wherein
the container drains a part of the mixed solution in the container each time the first condition is satisfied plural times, and the second supplier supplies the additive to the container each time the first condition is satisfied, and the second supplier supplies the additive to the container when drainage of a part of the mixed solution is finished in a case where the container drains a part of the mixed solution.

12 . The apparatus of claim 3 , wherein
the container drains a part of the mixed solution in the container each time the first condition is satisfied plural times, and the second supplier supplies the additive to the container each time the first condition is satisfied, and the second supplier supplies the additive to the container when drainage of a part of the mixed solution is finished in a case where the container drains a part of the mixed solution.

13 . The apparatus of claim 1 , wherein
the processing solution is a processing solution for plating processing of the substrate, and the additive contains at least an accelerator accelerating the plating processing.

14 . A chemical management method using a semiconductor manufacturing apparatus comprising a container containing a mixed solution that includes a processing solution for plating processing of a substrate and an additive, a first supplier supplying the processing solution to the container, and a second supplier supplying the additive to the container, the method comprising:
draining a part of the mixed solution from the container when a first condition is satisfied; and supplying the additive to the container by means of the second supplier when the first condition is satisfied and drainage of a part of the mixed solution is finished.

15 . The method of claim 14 , wherein the first condition is a fact that a concentration of the additive in the mixed solution has fallen below a predetermined value.

16 . The method of claim 15 , further comprising: calculating a calculation value of a concentration of the additive based on a drainage amount of the mixed solution, a supply amount of the processing solution from the first supplier, and a supply amount of the additive from the second supplier, wherein
a concentration of the additive to be used for the first condition is a calculation value of a concentration of the additive.

17 . The method of claim 14 , further comprising: measuring a concentration of the additive in the container, wherein
a concentration of the additive to be used for the first condition is a measurement value of a concentration of the additive.

18 . The method of claim 14 , wherein the first condition is a fact that a predetermined period has passed from drainage of a part of the mixed solution or supply of the additive.

19 . The method of claim 14 , wherein
drainage of a part of the mixed solution in the container is performed each time the first condition is satisfied plural times, and supply of the additive is performed each time the first condition is satisfied, and the supply of the additive is performed when drainage of a part of the mixed solution is finished in a case where a part of the mixed solution is to be drained.

Assignees

• Toshiba Kk

Inventors

• Izumi Takashi
• Ikegaya Fumitoshi

Classifications

• C25D3/38

  of copper · CPC title

• C25D21/14

  Controlled addition of electrolyte components · CPC title

• C25D7/123 Primary

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• H05K3/424

  by direct electroplating · CPC title

• C25D21/18

  of electrolytes (C25D21/22 takes precedence) · CPC title