Inductively coupled plasma source
US-2019108974-A1 · Apr 11, 2019 · US
US12580153B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12580153-B2 |
| Application number | US-202418412042-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 12, 2024 |
| Priority date | Jan 12, 2024 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
According to an embodiment, a plasma processing system is proposed. The plasma processing system includes a plasma chamber; an RF source configured to generate a forward RF wave; an impedance matching circuit coupled to the RF source, the impedance matching circuit configured to provide matching for the RF source; a balun having unbalanced terminals coupled to the impedance matching circuit; and a resonant antenna configured to generate plasma within the plasma chamber, the resonant antenna being a spiral resonant antenna with an electrical length corresponding to a half-wavelength of a frequency of the forward RF wave, the resonant antenna comprising: a first tap along the spiral resonant antenna coupled to a first balanced terminal of the balun and a second tap along the spiral resonant antenna coupled to a second balanced terminal of the balun.
Opening claim text (preview).
What is claimed is: 1 . A plasma processing system, comprising: a plasma chamber; an RF source configured to generate a forward RF wave; an impedance matching circuit coupled to the RF source, the impedance matching circuit configured to provide matching for the RF source; a balun having unbalanced terminals coupled to the impedance matching circuit; and a resonant antenna configured to generate plasma within the plasma chamber, the resonant antenna being a single spiral resonant antenna with an electrical length corresponding to a half-wavelength of a frequency of the forward RF wave, the resonant antenna comprising: a first tap along the single spiral resonant antenna coupled to a first balanced terminal of the balun, and a second tap along the single spiral resonant antenna coupled to a second balanced terminal of the balun. 2 . The plasma processing system of claim 1 , wherein the impedance matching circuit comprises: a first variable capacitor arranged between the balun and the RF source; a first inductor arranged between the first balanced terminal of the balun and the first tap; a second inductor arranged between the second balanced terminal of the balun and the second tap; and a second variable capacitor arranged between the first balanced terminal of the balun and the first tap, the second variable capacitor being in series with the first inductor. 3 . The plasma processing system of claim 1 , wherein the impedance matching circuit comprises: a first variable capacitor arranged between the balun and the RF source; a first inductor arranged between the first balanced terminal of the balun and the first tap; a second inductor arranged between the second balanced terminal of the balun and the second tap; and a second variable capacitor arranged between the second balanced terminal of the balun and the second tap, the second variable capacitor being in series with the second inductor. 4 . The plasma processing system of claim 1 , wherein an operating frequency of the RF source is 27 megahertz (MHz). 5 . The plasma processing system of claim 1 , wherein the single spiral resonant antenna comprises: a first portion having an electrical length corresponding to a quarter of a wavelength of a frequency of the forward RF wave, the first portion having a first end and a second end, the first end coupled to the first balanced terminal of the balun; a second portion having an electrical length corresponding to the quarter of the wavelength of the frequency of the forward RF wave, the second portion having a first end and a second end, the first end coupled to the second balanced terminal of the balun; and a conductive coupling structure electrically coupling the first end of the first portion to the first end of the second portion. 6 . The plasma processing system of claim 5 , wherein the first portion and the second portion are arranged in a symmetrically nested configuration having a same center point. 7 . The plasma processing system of claim 5 , wherein the second end of the first portion and the second end of the second portion are coupled to a reference ground. 8 . The plasma processing system of claim 5 , wherein the second end of the first portion and the second end of the second portion are floating. 9 . An apparatus for generating plasma in a plasma processing system, the apparatus comprising: a plasma chamber; an RF source configured to generate a forward RF wave; an impedance matching circuit coupled to the RF source, the impedance matching circuit configured to provide matching for the RF source; a balun having unbalanced terminals coupled to the impedance matching circuit; a resonant antenna configured to generate plasma within the plasma chamber, the resonant antenna being a single spiral resonant antenna with an electrical length corresponding to a half-wavelength of a frequency of the forward RF wave, the resonant antenna comprising: a first tap along the single spiral resonant antenna coupled to a first balanced terminal of the balun, and a second tap along the single spiral resonant antenna coupled to a second balanced terminal of the balun; a non-transitory memory storage comprising instructions; and a processor in communication with the non-transitory memory storage and coupled to the impedance matching circuit, wherein the instructions, when executed by the processor, cause the processor to provide a matching impedance between the RF source and the resonant antenna. 10 . The apparatus of claim 9 , wherein the instructions, when executed by the processor, cause the processor to generate a first current flowing into the single spiral resonant antenna to be equal to a second current flowing out of the single spiral resonant antenna. 11 . The apparatus of claim 9 , wherein the impedance matching circuit comprises: a first variable capacitor arranged between the balun and the RF source; a first inductor arranged between the first balanced terminal of the balun and the first tap; a second inductor arranged between the second balanced terminal of the balun and the second tap; and a second variable capacitor arranged between the first balanced terminal of the balun and the first tap, the second variable capacitor being in series with the first inductor. 12 . The apparatus of claim 9 , wherein the impedance matching circuit comprises: a first variable capacitor arranged between the balun and the RF source; a first inductor arranged between the first balanced terminal of the balun and the first tap; a second inductor arranged between the second balanced terminal of the balun and the second tap; and a second variable capacitor arranged between the second balanced terminal of the balun and the second tap, the second variable capacitor being in series with the second inductor. 13 . The apparatus of claim 9 , wherein the single spiral resonant antenna comprises: a first portion having an electrical length corresponding to a quarter of a wavelength of a frequency of the forward RF wave, the first portion having a first end and a second end, the first end coupled to the first balanced terminal of the balun; a second portion having an electrical length corresponding to the quarter of the wavelength of the frequency of the forward RF wave, the second portion having a first end and a second end, the first end coupled to the second balanced terminal of the balun; and a conductive coupling structure electrically coupling the first end of the first portion to the first end of the second portion. 14 . The apparatus of claim 13 , wherein the first portion and the second portion are arranged in a symmetrically nested configuration having a same center point. 15 . The apparatus of claim 13 , wherein the second end of the first portion and the second end of the second portion are coupled to a reference ground. 16 . The apparatus of claim 13 , wherein the second end of the first portion and the second end of the second portion are floating. 17 . A plasma processing system, comprising: a plasma chamber; an RF source configured to generate a forward RF wave; a balun having unbalanced terminals coupled to the RF source; an impedance matching circuit coupled to the RF source and the balun, the impedance matching circuit configured to provide matching for the RF source, the impedance matching circuit comprising: a first variable capacitor arranged between the balun and the RF source, and a first inductor, a second inductor, and a second variable capacitor arranged between the balun and the plas
Matching circuits · CPC title
the radio frequency energy being inductively coupled to the plasma · CPC title
Antennas, e.g. particular shapes of coils · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.