Light-emitting substrate and manufacturing method thereof, and display device

Patent metadata

Field	Value
Publication number	US-12575234-B2
Application number	US-202117793975-A
Country	US
Kind code	B2
Filing date	May 17, 2021
Priority date	Jun 30, 2020
Publication date	Mar 10, 2026
Grant date	Mar 10, 2026

Abstract

A light-emitting substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method includes: providing a base substrate; forming a first conductive pattern on the base substrate using a first mask; forming a first insulating layer on the first conductive pattern using a second mask, to form a first via hole and a second via hole; forming a second conductive pattern on the first insulating layer using the first mask, the second conductive pattern being electrically connected to the first conductive pattern through the first via hole and the second via hole; forming a second insulating layer on the second conductive pattern using the second mask, to form a third via hole; and forming a third conductive pattern on the second insulating layer using a third mask, the third conductive pattern being electrically connected to the second conductive pattern through the third via hole.

First claim

What is claimed is:

1 . A manufacturing method of a light-emitting substrate, comprising:
providing a base substrate; forming a first conductive pattern on the base substrate using a first mask comprising a first mask pattern; forming a first insulating layer on the first conductive pattern using a second mask comprising a second mask pattern, to form a first via hole and a second via hole exposing a partial region of the first conductive pattern, wherein the second mask pattern is different from the first mask pattern; forming a second conductive pattern on the first insulating layer using the first mask, wherein the second conductive pattern at least partially overlaps with the first via hole and the second via hole in a direction perpendicular to the base substrate, and is electrically connected to the first conductive pattern through the first via hole and the second via hole; forming a second insulating layer on the second conductive pattern using the second mask, to form a third via hole and a fourth via hole exposing a partial region of the second conductive pattern; and forming a third conductive pattern on the second insulating layer using a third mask comprising a third mask pattern, wherein the third conductive pattern at least partially overlaps with the third via hole in the direction perpendicular to the base substrate and is electrically connected to the second conductive pattern through the third via hole, and the third mask pattern is different from the first mask pattern and the second mask pattern; wherein an orthographic projection of the first via hole on the base substrate at least partially overlaps with an orthographic projection of the third via hole on the base substrate, and an orthographic projection of the second via hole on the base substrate at least partially overlaps with an orthographic projection of the fourth via hole on the base substrate.

2 . The manufacturing method of the light-emitting substrate according to claim 1 , wherein the first mask pattern comprises a first preparation pattern for forming a conductive pattern and a first positioning pattern for positioning, and the second mask pattern comprises a second preparation pattern for forming an insulating pattern and a second positioning pattern for positioning; and
the manufacturing method further comprises: forming a first positioning structure using the first positioning pattern of the first mask while forming the first conductive pattern on the base substrate using the first mask; in a process of forming the first insulating layer on the first conductive pattern using the second mask, using the first positioning structure to cooperate with the second positioning pattern of the second mask to position the second mask, and forming a second positioning structure using the second positioning pattern of the second mask while forming the first via hole and the second via hole; in a process of forming the second conductive pattern on the first insulating layer using the first mask, using the second positioning structure to cooperate with the first positioning pattern of the first mask to position the first mask, and forming a third positioning structure using the first positioning pattern of the first mask while forming the second conductive patter; and in a process of forming the second insulating layer on the second conductive pattern using the second mask, using the third positioning structure to cooperate with the second positioning pattern of the second mask to position the second mask.

3 . The manufacturing method of the light-emitting substrate according to claim 2 , wherein the first positioning pattern comprises a first sub-pattern and a second sub-pattern, and the second positioning pattern comprises a third sub-pattern and a fourth sub-pattern;
the first sub-pattern of the first positioning pattern is used to form the first positioning structure and the third positioning structure, and the fourth sub-pattern of the second positioning pattern is used to form the second positioning structure; and the second sub-pattern of the first positioning pattern corresponds to the fourth sub-pattern of the second positioning pattern for positioning the first mask, and the third sub-pattern of the second positioning pattern corresponds to the first sub-pattern of the first positioning pattern for positioning the second mask.

4 . The manufacturing method of the light-emitting substrate according to claim 2 , wherein forming the first conductive pattern on the base substrate using the first mask comprises:
forming the first conductive pattern on the base substrate through the first preparation pattern of the first mask; forming the second conductive pattern on the first insulating layer using the first mask comprises:
forming the second conductive pattern on the first insulating layer through the first preparation pattern of the first mask,
wherein the first conductive pattern and the second conductive pattern comprise same conductive pattern portions, and the same conductive pattern portions at least partially overlap in the direction perpendicular to the base substrate.

5 . The manufacturing method of the light-emitting substrate according to claim 2 , wherein forming the first insulating layer on the first conductive pattern using the second mask comprises:
forming the first insulating layer on the first conductive pattern through the second preparation pattern of the second mask; and forming the second insulating layer on the second conductive pattern using the second mask comprises:
forming the second insulating layer on the second conductive pattern through the second preparation pattern of the second mask,
wherein the first insulating layer and the second insulating layer comprise same via hole pattern portions, and the same via hole pattern portions at least partially overlap in the direction perpendicular to the base substrate.

6 . The manufacturing method of the light-emitting substrate according to claim 1 , further comprising:
forming a fourth conductive pattern on the third conductive pattern using the third mask, wherein an orthographic projection of the fourth conductive pattern on the base substrate at least partially overlaps with an orthographic projection of the third conductive pattern on the base substrate.

7 . The manufacturing method of the light-emitting substrate according to claim 6 , wherein a material of the third conductive pattern comprises a first metal material, a material of the fourth conductive pattern comprises a second metal material, and the first metal material is different from the second metal material.

8 . The manufacturing method of the light-emitting substrate according to claim 1 , further comprising:
forming a fifth conductive pattern, different from the third conductive pattern, on the second insulating layer using the third mask while forming the third conductive pattern on the second insulating layer using the third mask, wherein the fifth conductive pattern is insulated from the first conductive pattern and the second conductive pattern, and a light-emitting element is electrically connected to an output terminal of a driving circuit through the fifth conductive pattern.

9 . The manufacturing method of the light-emitting substrate according to claim 8 , further comprising:
forming a third insulating layer, at least partially covering the third conductive pattern and the fifth conductive pattern, on the third conductive pattern and the fifth conductive pattern using a fourth mask, wherein the third insulating layer comprises a first connection via hole for electrically connecting the fifth conductive pattern to the light-emitting element, and the second

Assignees

• Hefei Xinsheng Optoelectronics Technology Co Ltd
• Boe Technology Group Co Ltd
• Hefei Xinshengn Optoelectronics Tech Co Ltd

Inventors

• Xie Xiaodong
• He Min
• Wang Jing
• Zhang Tianyu
• Zhao Xue
• Zhong Tengfei

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• G02F1/133612

  Electrical details · CPC title

• G02F1/133603 Primary

  with LEDs · CPC title