Touch substrate and fabrication method thereof, and electronic device

Patent metadata

Field	Value
Publication number	US-10600636-B2
Application number	US-201715815749-A
Country	US
Kind code	B2
Filing date	Nov 17, 2017
Priority date	Feb 27, 2017
Publication date	Mar 24, 2020
Grant date	Mar 24, 2020

Abstract

Embodiments of the present disclosure provide a touch substrate and a fabrication method thereof, and an electronic device. The fabrication method of the touch substrate includes: providing a substrate; and sequentially forming a first touch electrode layer, a first insulating layer, a second touch electrode layer and a second insulating layer on the substrate. The first touch electrode layer includes a first touch electrode, and the second touch electrode layer includes a second touch electrode. The step of forming the first insulating layer and the step of forming the second insulating layer are performed by using a single mask.

First claim

What is claimed is:

1. A fabrication method of a touch substrate, comprising:
providing a substrate; and
sequentially forming a first touch electrode layer, a first insulating layer, a second touch electrode layer, and a second insulating layer on the substrate, wherein the first touch electrode layer comprises a first touch electrode, and the second touch electrode layer comprises a second touch electrode; and
wherein the step of forming the first insulating layer and the step of forming the second insulating layer are performed by using a single mask.

2. The fabrication method according to claim 1 , wherein the first insulating layer is formed by using a coating process or an evaporation process, and the first insulating layer is patterned by using the mask; and the second insulating layer is formed by using the coating process or the evaporation process, and the second insulating layer is patterned by using the mask.

3. The fabrication method according to claim 2 , wherein before forming the first touch electrode layer, the fabrication method further comprises:
forming a black matrix in the edge region of the substrate.

4. The fabrication method according to claim 3 wherein the first touch electrode layer and the second touch electrode layer comprise at least one of a conductive metal oxide and a conductive metal.

5. The fabrication method according to claim 4 , wherein the touch substrate is fabricated by way of conductive metal oxide bridging, and the mask comprises a first region corresponding to an insulating layer of a bridging contact region, a second region corresponding to a black matrix layer, and a hollow area corresponding to a connection portion.

6. The fabrication method according to claim 4 , wherein the touch substrate is fabricated by way of a two-layer conductive metal mesh, and the mask comprises a hollow area corresponding to a connection portion.

7. The fabrication method according to claim 1 further comprising:
forming a first conducting wire at least electrically connecting the first touch electrode in an edge region of the substrate.

8. The fabrication method according to claim 7 further comprising:
forming a second conducting wire at least electrically connecting the second touch electrode in the edge region of the substrate.

9. The fabrication method according to claim 8 , wherein before forming the first touch electrode layer, the fabrication method further comprises:
forming a black matrix in the edge region of the substrate;
wherein the first touch electrode layer and the second touch electrode layer comprise at least one of a conductive metal oxide and a conductive metal.

10. The fabrication method according to claim 9 , wherein
in case that the touch substrate is fabricated by way of conductive metal oxide bridging, the mask comprises a first region corresponding to an insulating layer of a bridging contact region, a second region corresponding to a black matrix layer, and a hollow area corresponding to a connection portion; and
in case that the touch substrate is fabricated by way of a two-layer conductive metal mesh, the mask comprises a hollow area corresponding to a connection portion.

11. The fabrication method according to claim 1 , wherein before forming the first touch electrode layer, the fabrication method further comprises:
forming a black matrix in the edge region of the substrate.

12. The fabrication method according to claim 11 , wherein the first touch electrode layer and the second touch electrode layer comprise at least one of a conductive metal oxide and a conductive metal.

13. The fabrication method according to claim 12 , wherein the touch substrate is fabricated by way of conductive metal oxide bridging, and the mask comprises a first region corresponding to an insulating layer of a bridging contact region, a second region corresponding to a black matrix layer, and a hollow area corresponding to a connection portion.

14. The fabrication method according to claim 12 , wherein the touch substrate is fabricated by way of a two-layer conductive metal mesh, and the mask comprises a hollow area corresponding to a connection portion.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• He Min
• Xu Shifeng
• Wang Jing
• Hu Xiaojuan
• Xie Xiaodong
• Zhang Ming

Classifications

• H10P14/60

  of insulating materials · CPC title

• G06F3/044

  by capacitive means · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F2203/04111

  Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title

• G06F2203/04112

  Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title