Method of electroless gold plating
US-9388497-B2 · Jul 12, 2016 · US
Method of electroless gold plating
US2016265115A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016265115-A1 |
| Application number | US-201615163437-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 24, 2016 |
| Priority date | Jul 13, 2012 |
| Publication date | Sep 15, 2016 |
| Grant date | — |
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Abstract
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A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of electroless gold plating comprising: forming an underlying alloy layer on a metallic base material; and forming a gold plate layer directly on the underlying alloy layer by means of electroless reduction plating using a cyanide-free gold plating bath, wherein the underlying alloy layer is formed of an M1-M2-M3 alloy, and M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B. 2 . The method as set forth in claim 1 , wherein a ratio of each element in the M1-M2-M3 alloy is that M1 is 20 to 50 at. %, M2 is 30 to 50 at. %, and M3 is 20 to 30 at. %. 3 . The method as set forth in claim 1 , further comprising forming a modifying layer on the metallic base material in order to enhance the interfacial adhesion property between the metallic base material and the underlying alloy layer before forming the underlying alloy layer. 4 . The method as set forth in claim 1 , wherein the thickness of the underlying alloy layer is 0.01 to 1.0 μm. 5 . The method as set forth in claim 1 , wherein the thickness of the gold plate layer is 1 to 200 nm.
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Classifications
Alloys based on gold · CPC title
Contact plating, i.e. electroless electrochemical plating · CPC title
Containing 0.01-1.7% carbon [i.e., steel] · CPC title
Co- or Ni-base component next to Fe-base component · CPC title
in the form of layered or coated products · CPC title
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- What does patent US2016265115A1 cover?
- A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn,…
- Who is the assignee on this patent?
- Toyo Kohan Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C18/42. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Sep 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).