High resistivity soft magnetic material for miniaturized power converter
US-2016284451-A1 · Sep 29, 2016 · US
Gold plate coated material
US2016265114A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016265114-A1 |
| Application number | US-201615163419-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 24, 2016 |
| Priority date | Jul 13, 2012 |
| Publication date | Sep 15, 2016 |
| Grant date | — |
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Abstract
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A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.
First claim
Opening claim text (preview).
What is claimed is: 1 . A gold plate coated material comprising: a base material; an underlying alloy layer formed on the base material; and a gold plate layer formed on the underlying alloy layer, wherein the underlying alloy layer is formed of an M1-M2-M3 alloy, and where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B. 2 . The gold plate coated material as set forth in claim 1 , wherein a ratio of each element in the M1-M2-M3 alloy is that M1 is 20 to 50 at. %, M2 is 30 to 50 at. %, and M3 is 20 to 30 at. %. 3 . The gold plate coated material as set forth in claim 1 , further comprising a modifying layer which is formed on the base material in order to enhance the interfacial adhesion property between the base material and the underlying alloy layer. 4 . The gold plate coated material as set forth in claim 1 , wherein the thickness of the underlying alloy layer is 0.01 to 1.0 μm. 5 . The gold plate coated material as set forth in claim 1 , wherein the thickness of the gold plate layer is 1 to 200 nm.
Assignees
Inventors
Classifications
Ni-base component · CPC title
Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process (C23C26/00, C23C28/00 take precedence) · CPC title
Next to Co-, Cu-, or Ni-base component · CPC title
with magnesium as the next major constituent · CPC title
Au-base component · CPC title
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- What does patent US2016265114A1 cover?
- A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn,…
- Who is the assignee on this patent?
- Toyo Kohan Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C23C18/1831. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Sep 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).