Film formation device and film formation method for metal plating film

Patent metadata

Field	Value
Publication number	US-11674228-B2
Application number	US-202117547541-A
Country	US
Kind code	B2
Filing date	Dec 10, 2021
Priority date	Dec 15, 2020
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

Provided is a device and a method for forming a metal plating film having a thick film thickness by a solid substitution-type electroless plating method. The present disclosure relates to a film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution-type electroless plating method, comprising: a conductive mounting base; a third metal; an insulating material; a microporous membrane; a plating bath chamber; and a pressing unit, wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and wherein the insulating material is installed between a base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.

First claim

What is claimed is:

1. A film formation device for forming a film of a first metal on a plating film of a second metal by a solid substitution electroless plating method, the film formation device comprising:
a conductive mounting base adapted to install a base material having the plating film of the second metal;
a third metal installed on the conductive mounting base;
an insulating material installed on the conductive mounting base;
a microporous membrane adapted to be impregnated with a substitution electroless plating bath containing ions of the first metal, the substitution electroless plating bath containing the ions of the first metal being delivered to the plating film of the second metal on the base material through the microporous membrane;
a plating bath chamber provided with an opening portion in which the microporous membrane is installed, the plating bath chamber being adapted to house the substitution electroless plating bath containing the ions of the first metal; and
a press adapted to relatively press the plating bath chamber and the base material against each other after bringing the microporous membrane and the plating film of the second metal on the base material into contact with each other,
wherein the third metal has an ionization tendency larger than ionization tendencies of the first metal and the second metal, and
wherein the insulating material is installed between the base material and the third metal so as to contact respective materials of the base material and the third metal when the base material having the plating film of the second metal is installed.

2. The film formation device according to claim 1 ,
wherein when the base material having the plating film of the second metal is installed, the base material having the plating film of the second metal, the third metal, and the insulating material have a same height and become flush.

3. The film formation device according to claim 1 ,
wherein the conductive mounting base has a protruding portion at a position at which the third metal is installed, the protruding portion has a width (here, width is a length in a direction in which the base material, the insulating material, and the third metal are arranged) a same as a width of the third metal, and the third metal is installed on the protruding portion of the conductive mounting base.

4. The film formation device according to claim 1 ,
wherein the third metal is aluminum or iron.

5. The film formation device according to claim 1 ,
wherein the insulating material contains an insulating polymer.

6. The film formation device according to claim 1 ,
wherein the base material is a copper base material, the first metal is gold, and the second metal is nickel.

7. A method for forming a film of a first metal on a plating film of a second metal by a solid substitution electroless plating method, the method comprising:
(i) installing a base material having the plating film of the second metal on a conductive mounting base such that a surface of the base material opposite to a surface on which the plating film of the second metal is formed contacts the conductive mounting base;
(ii) installing a third metal on the conductive mounting base, the third metal having an ionization tendency larger than ionization tendencies of the first metal and the second metal;
(iii) installing an insulating material between the base material and the third metal on the conductive mounting base such that the insulating material contacts respective materials of the base material and the third metal;
(iv) installing a microporous membrane such that the microporous membrane contacts the plating film of the second metal on the base material;
(v) installing a substitution electroless plating bath containing ions of the first metal such that the substitution electroless plating bath containing the ions of the first metal contacts the microporous membrane; and
(vi) relatively pressing a plating bath chamber and the base material against each other, the plating bath chamber housing the substitution electroless plating bath containing the ions of the first metal.

8. The method according to claim 7 ,
wherein the third metal is aluminum or iron.

9. The method according to claim 7 ,
wherein the base material is a copper base material, the first metal is gold, and the second metal is nickel.

Assignees

• Toyota Motor Co Ltd

Inventors

• Sato Yuki

Classifications

• C23C18/1637 Primary

  metallic substrate · CPC title

• C23C18/163

  Supporting devices for articles to be coated · CPC title

• C23C18/1648

  Porous product · CPC title

• C23C18/1664 Primary

  with additional means during the plating process · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title